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Showing results 93701 to 93720 of 279412

93701
Flight Controller Design of a Flapping-Wing MAV in a Magnetically Levitated Environment

이동규; Han, Jae-Hung, 2013 IEEE International Conference on Robotics and Automation (ICRA), pp.1368 - 1373, Institute of Electrical and Electronics Engineers, 2013-05-07

93702
Flight Dynamics and Navigation for Planetary Missions in Korea: Past Efforts, Recent Status, and Future Preparations

Song, Young-Joo; Lee, Donghun; Bae, Jonghee; Kim, Young-Rok; Choi, Sun-Jin, JOURNAL OF ASTRONOMY AND SPACE SCIENCES, v.35, no.3, pp.119 - 131, 2018-09

93703
Flight dynamics and stability of bioinspired ornithopters = 생체모방 날갯짓비행체의 비행 동역학 및 안정성에 관한 연구link

Lee, Jun-Seong; 이준성; et al, 한국과학기술원, 2013

93704
FLIGHT DYNAMICS OF FLAPPING-WING MICRO AIR VEHICLES: AN INTEGRATIVE ANALYSIS OF NONLINEAR FLIGHT DYNAMICS AND UNSTEADY AERODYNAMICS

Han, Jae Hung, ASME-JSME-KSME Joint Fluids Engineering Conference 2015, KSME, 2015-07-26

93705
Flight Goggles 시뮬레이터의 모델 분석 및 움직이는 가상의 목표를 이용한 자율 비행

위인환; 이응창; 김태연; 심현철, 한국항공우주학회 2019년도 춘계학술대회, 한국항공우주학회, 2019-04-18

93706
Flight Path Angle Control of Small Scale Rotary Unmanned Aerial Vehicle

Kannan, Somasundar; Lian, B.H.; Bang, Hyochoong, KSAS-JSASS Joint Symposium on Aerospace Engineering, pp.150 - 153, KSAS, JSASS, 2004-11-18

93707
Flight Technical Error Evaluations for GBAS Navigation Requirement Definition

Felux, Michael; Lee, Jiyun; Holzapfel, Florian, 31st Congress of the International Council of the Aeronautical Sciences, ICAS 2018, International Council of the Aeronautical Sciences, 2018-09

93708
Flight test environment using magnetic levitation for flight characteristics identification of MAV

Sung, Yeol-Hun; Lee, Dong-Kyu; Kim, Ho-Young; Han, Jae-Hung, 29th International Conference on Adaptive Structures and Technologies (ICAST 2018), ICAST, 2018-10-01

93709
Flight testing of a university based H2O2/HDPE hybrid sounding rocket at KAIST

Huh, Jeongmoo; Kim, Youngil; Yun, Yongtae; Ahn, Byeonguk; Kwon, Sejin; Lee, Jaewan; Yoon, Hosung, 53rd AIAA/SAE/ASEE Joint Propulsion Conference, 2017, American Institute of Aeronautics and Astronautics Inc, AIAA, 2017-07

93710
Flight testing of an University based H2O2/HDPE Hybrid Sounding Rocket at KAIST

Huh, Jeongmoo; Kim, Youngil; Yun, Yongtae; Ahn, Byeonguk; Kwon, Sejin, 2017 Propulsion and energy (53rd JPC), The American Institute of Aeronautics and Astronautics, 2017-07-11

93711
Flight testing of technology demonstrator with hydrogen peroxide hybrid rocket

Yun, Yongtae; Seo, Joungki; Park, Kiyun; Jeong, Junyeong; Kim, Juwon; Kwon, Sejin, AIAA Propulsion and Energy Forum and Exposition, 2019, American Institute of Aeronautics and Astronautics Inc, AIAA, 2019-08-21

93712
Flight Tests of the Vision-based Target Sensing and Approaching

Cho, Sungwook; Jeong, Yeun Duk; Shim, David Hyunchul, the 30th Congress of the International Council of the Aeronautical Sciences, pp.1 - 7, International Council of the Aeronautical Sciences, 2016-09-26

93713
FlightGoggles 시뮬레이터를 이용한 Drone의 Visual-Inertial 상태 추정(VINS-Mono)에 관한 분석

이응창; 위인환; 김태연; 문상근; 심현철, 한국항공우주학회 2019년도 춘계학술대회, 한국항공우주학회, 2019-04-18

93714
Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump

Paik, Kyung-Wook, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01

93715
Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps

백경욱, 한국재료학회 추계학술대회, pp.81 - 81, 한국재료학회, 1998-11-01

93716
Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps

Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01

93717
Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump

Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13

93718
Flip chip assembly on PCB substrates with coined solder bumps

Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27

93719
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03

93720
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27

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