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Showing results 87072 to 87091 of 99844
| W 에 의한 Mo 치환이 850℃ 에서 시효된 이상 스테인레스강의 취화 특성에 미치는 영향 김상범; 백경욱; 김영길, 대한금속·재료학회지, v.35, no.12, pp.1593 - 1601, 1997-12 |
| W(CO)5(L)-Catalyzed Endo-Selective Cyclization of Allenyl Silyl Enol Ethers: An Efficient Method for the Cyclopentene Annulation onto a,b-Unsaturat Kim, Sung Gak, ORGANIC LETTERS, v.5, no.10, pp.1725 - 1728, 2003-05 |
| (W,Ti)C계 초경합금의 미세조직 및 경도에 미치는금속 결합재 조성의 영향 Walid M. Daoush; 이경호; 박희섭; 장종준; 홍순형, 한국분말야금학회지, v.14, no.3, pp.208 - 214, 2007-06 |
| W-Band Compact Balun-Embedded SPDT Switch With Leakage-Canceled Overlapped Transformers Lee, Seungchan; Park, Jinseok; Hong, Songcheol, IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS, v.33, no.11, pp.1532 - 1535, 2023-11 |
| W-incorporated CoMo/gamma-Al2O3 hydrodesulfurization catalyst .1. Catalytic activities Lee, DK; Lee, IC; Park, SK; Bae, SY; Woo, Seong-Ihl, JOURNAL OF CATALYSIS, v.159, no.1, pp.212 - 218, 1996-03 |
| W-incorporated CoMo/gamma-Al2O3 hydrodesulfurization catalyst .2. Characterization Lee, DK; Lee, HT; Lee, IC; Park, SK; Bae, SY; Kim, CH; Woo, Seong-Ihl, JOURNAL OF CATALYSIS, v.159, no.1, pp.219 - 229, 1996-03 |
| W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거 홍성현; 강석중; 윤덕용, 대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01 |
| W0.5TaTiVCr-based composite reinforced with W-mesh for fusion plasma-facing applications Waseem, Owais Ahmed; Ryu, Ho Jin, FUNCTIONAL COMPOSITES AND STRUCTURES, v.2, no.1, pp.015004, 2020-03 |
| Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations Yu, Tae-Sun; Lee, Tae-Eog, INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, v.58, no.2, pp.434 - 447, 2020-01 |
| Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types Ko, Sung-Gil; Yu, Tae-Sun; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.18, no.3, pp.1516 - 1526, 2021-07 |
| Wafer distribution system for a clean room using a novel magnetic suspension technique Park, KH; Ahn, KY; Kim, Soohyun; Kwak, Yoon Keun, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.3, no.1, pp.73 - 78, 1998-03 |
| Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정 배귀남; 박승오; 이춘식; 명현국; 신흥태, 설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-scale controlled Au/Pt bimetallic flowerlike structure array Huang, Xing-Jiu; Kim, Ju-Hyun; Choi, Yang-Kyu, GOLD BULLETIN, v.41, no.1, pp.58 - 65, 2008-04 |
| Wafer-scale crack-free AlGaN on GaN through two-step selective-area growth for optically pumped stimulated emission Ko, Young-Ho; Bae, Sung-Bum; Kim, Sung-Bock; Kim, Dong Churl; Leem, Young Ahn; Cho, Yong-Hoon; Nam, Eun-Soo, JOURNAL OF CRYSTAL GROWTH, v.445, pp.78 - 83, 2016-07 |
| Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01 |
| Wafer-Scale Multilayer Fabrication for Silk Fibroin-Based Microelectronics Kook, Geon; Jeong, Sohyeon; Kim, So Hyun; Kim, MiKyung; Lee, Sungwoo; Cho, Il-Joo; Choi, Nakwon; et al, ACS APPLIED MATERIALS & INTERFACES, v.11, no.1, pp.115 - 124, 2019-01 |
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