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Showing results 141201 to 141220 of 279406
| Noise and Interference Characterization for MLC Flash Memories Moon, Jaekyun; No, J.; Lee, S.; Kim, S.; Yang, J.; Chang, S., International Conference on Computing, Networking and Communications 2012, IEEE, 2012-01-30 |
| Noise and Vibration Characteristics of Externally Pressurized Slot-Restricted Air Journal Bearings Rho, BH; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2003-10-26 |
| Noise and Vibration Phenomena of On-Line Electric Vehicle Shin, Eun-Gyeong; Ahlswede, Michael; Muenzberg, Christopher; Suh, In-Soo; Engel, Ferhat, SAE 2011 Noise and Vibration Conference and Exhibition, SAE, 2011-04 |
| Noise aware depth denoising for a time-of-flight camera Kweon, In-So; Jung, Jiyoung; Lee, Joon Young, 20th Korea-Japan Joint Workshop on Frontiers of Computer Vision, Asian Federation of Computer Vision (AFCV), 2014-02-05 |
| Noise bandwidth suppression circuit for low noise IRFPA Kim, B.; Kang, S.-G.; Lee, Hee Chul; Kim, C.-K., Infrared Technology and Applications XXVIII, v.4820, no.1, pp.327 - 333, 2002-07-07 |
| Noise bandwidth suppression for low noise readout circuit Kim, B; Lee, Hee Chul, ELECTRONICS LETTERS, v.38, no.12, pp.558 - 560, 2002-06 |
| Noise barrier with top cylindrical tubes Jung, Sung Soo; Kim, Yong Tae; Cheong, Cheol Ung; Kim, Ho Chul; Lee, Woo Seop, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.49, no.1, pp.145 - 149, 2006 |
| Noise cancelling with autoassociative memory trained by order statistics Bae, J; Ryu, Y; Song, Iickho, Proceedings of the 1994 IEEE International Conference on Neural Networks. Part 1 (of 7), v.5, pp.3431 - 3436, 1994-06-27 |
| Noise Capacitive Sensor for Multi-Touch Mobile Handset's Applications Ko, S.; Shin, H.; Lee, J.; Jang, H.; So, B.-C.; Yun, I.; Lee, Kwyro, IEEE ASIAN SOLID-STATE CIRCUITS CONF., pp.113 - 116, IEEE, 2009-12 |
| Noise Characteristics of a Wavelength-Locked Fabry-Perot Laser Diode Park, Kun-Youl; Lee, Chang-Hee, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.44, no.11-12, pp.995 - 1002, 2008 |
| Noise Characteristics of Contra-Rotating Open Rotor with Time-Spectral CFD and Aeroacoustics Analysis Yi, Seulgi; Kwon, Hyungil; Im, Dong Kyun; Choi, Seongim; Lee, Duck Joo, AIAA SciTech 2016, AMER INST AERONAUT ASTRONAUT, 2016-01-06 |
| Noise Characteristics of Pile Driving Operation and Design of a Low-Noise Pile Cap Based on the Scale Model Experiment Ih, Jeong-Guon, Inter-Noise 2003, pp.0 - 0, 2003-08-01 |
| Noise control of zones: its theory and applications Jin-Young Park; Min-Ho Song; Jung-Min Lee; Tae-Woong Lee; Ji-Ho Chang; Kim, Yang-Hann, InterNoise 2010, Institute of Noise Control Engineering, 2010-06-16 |
| Noise coupling analysis and reduction in 3D-IC considering through-silicon via (TSV) nonlinearity = 3차원 집적회로에서 TSV의 비선형성을 고려한 노이즈 커플링 분석 및 감소에 관한 연구link Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2013 |
| Noise Coupling Analysis between TSV and Active Circuit Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Noise coupling analysis of power distribution network and signal traces in high-speed system on package (SoP) = 고속 패키지 내 시스템 (SoP) 에서 전력 분배 연결망과 신호선 사이의 노이즈 간섭 분석link Kim, Jin-Gook; 김진국; et al, 한국과학기술원, 2006 |
| Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
| Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation Kim, Joung-Ho; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, Sunkyu, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06 |
| Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
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