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Showing results 1 to 4 of 4

1
Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper

Lee, Ho Won; Im, Yong-Taek, MATERIALS TRANSACTIONS, v.51, no.9, pp.1614 - 1620, 2010-09

2
Globularization behavior of ELI grade Ti-6Al-4V alloy during non-isothermal multi-step forging

Kim, Jin Young; Park, Kyung-Tae; Shim, In Ok; Hong, Soon-Hyung, MATERIALS TRANSACTIONS, v.49, pp.215 - 223, 2008-01

3
High temperature deformation of Ti-(46-48)A1-2W intermetallic compounds

Kim, HY; Sohn, WH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.251, no.1-2, pp.216 - 225, 1998-08

4
On the modified grain-size-distribution method to evaluate the dynamic recrystallisation fraction in AISI 304 stainless steel

Hong, D. H.; Park, Joong-Keun, PHILOSOPHICAL MAGAZINE, v.98, no.10, pp.848 - 863, 2018-03

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