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Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates Yeo, Sung-Ku; Kim, Kyoung-Min; Chun, Jong-Hoon; Kwon, Young Se, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.6, pp.365 - 367, 2009 |
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