DSpace at KOASAS
Browsing DSpace

Browse by Subject underfill

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 3 of 3

1
(A) study on the thermal properties of underfill in flip-chip package = 플립칩용 언더필의 열적물성에 관한 연구link

Lee, Woong-Sun; 이웅선; et al, 한국과학기술원, 2005

2
Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process

Kwon, WS; Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.172 - 176, 2004-03

3
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04

Discover

rss_1.0 rss_2.0 atom_1.0