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The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound Cho, Soon-Jin; Paik, Kyung-Wook; Kim, Young-Gil, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.20, no.2, pp.167 - 175, 1997-05 |
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