Showing results 1 to 2 of 2
Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978, 2001-11 |
Field-aided thermal chemical vapor deposition of copper using Cu(I) organometallic precursor Lee, WJ; Rha, SK; Lee, SY; Park, Chong-Ook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.144, no.2, pp.683 - 686, 1997-02 |
Discover