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Showing results 1 to 12 of 12

1
A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias

Park, Junyong; Jung, Daniel H.; Kim, Byunggon; Choi, Sumin; Kim,Youngwoo; Park,Shinyoung; Park,Gapyeol; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.4, pp.1198 - 1206, 2019-08

2
A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10

3
Direct Z-Scheme Tannin-TiO2 Heterostructure for Photocatalytic Gold Ion Recovery from Electronic Waste

Kim, Kyeong Rak; Choi, Saehan; Yavuz, Cafer T.researcher; Nam, Yoon Sungresearcher, ACS SUSTAINABLE CHEMISTRY & ENGINEERING, v.8, no.19, pp.7359 - 7370, 2020-05

4
Gold recovery using porphyrin-based polymer from electronic wastes: Gold desorption and adsorbent regeneration

Son, Jieun; Hong, Yeongran; Han, Gyeol; Nguyen, Thien S.; Yavuz, Cafer T.researcher; Han, Jong-Inresearcher, SCIENCE OF THE TOTAL ENVIRONMENT, v.704, 2020-02

5
Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances

Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Jounghoresearcher; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08

6
Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Horesearcher; Shim, Yu-Jeong; Kim, Ga-Won, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.410 - 420, 2010-05

7
Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model

Kim, Jae-Min; Jeong, You-Chul; Lee, Jun-Ho; Ryu, Chung-Hyun; Shim, Jong-Joo; Shin, Min-Chul; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.544 - 557, 2008-08

8
Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model

Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02

9
Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Jounghoresearcher, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04

10
Optimal Allocation of Inspection Effort in a Serial Multi-Stage Production System

Bai, Do Sun; h. j. yun, COMPUTERS & INDUSTRIAL ENGINEERING, v.30, no.3, pp.387 - 396, 1996

11
Photochemically Enhanced Selective Adsorption of Gold Ions on Tannin-Coated Porous Polymer Microspheres

Kim, Jeonga; Kim, Kyeong Rak; Hong, Yeongran; Choi, Sunyoung; Yavuz, Cafer Tresearcher; Kim, Jin Woong; Nam, Yoon Sungresearcher, ACS APPLIED MATERIALS & INTERFACES, v.11, no.24, pp.21915 - 21925, 2019-06

12
Precious metal recovery from electronic waste by a porous porphyrin polymer

Hong, Yeongran; Thirion, Damien; Subramanian, Saravanan; Yoo, Mi; Choi, Hyuk; Kim, Hyun You; Stoddart, J. Fraser; et al, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.117, no.28, pp.16174 - 16180, 2020-07

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