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Showing results 1 to 3 of 3

1
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04

2
Interface imaging process for high resolution and high aspect ratio patterning

Woo, Seung A.; Park, Ji Young; Kim, Su Min; Kim, Jin-Baek, EUROPEAN POLYMER JOURNAL, v.49, no.6, pp.1707 - 1713, 2013-06

3
Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints

Lee, HyuckMo; Yoon, Seung Wook; Lee, Byeong-Joo, JOURNAL OF ELECTRONIC MATERIALS, v.27, no.11, pp.1161 - 1166, 1998

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