| 1 | Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
| 2 | Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
| 3 | Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
| 4 | Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| 5 | Grain morphology of intermetallic compounds at solder joints Choi, WK; Jang, SY; Kim, JH; Paik, Kyung-Wook; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.3, pp.597 - 599, 2002-03 |
| 6 | Mechanical and wear properties of SiCp/CNT/Al6061 hybrid metal matrix composites Van Trinh, Pham; Lee, Junho; Kang, Byungchul; Minh, Phan Ngoc; Phuong, Doan Dinh; Hong, Soon Hyung, DIAMOND AND RELATED MATERIALS, v.124, 2022-04 |
| 7 | Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| 8 | Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02 |
| 9 | Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| 10 | The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| 11 | 무연 솔더와 무전해 니켈-인 하부금속 층간의 계면 반응과 솔더 조인트에 미치는 비스무스 합금의 영향 = Effects of Bi on interfacial reaction and bump strength in electroless Ni-P UBM/ Pb-free solder bumpslink 조문기; Cho, Moon-Gi; et al, 한국과학기술원, 2004 |
| 12 | 무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMslink 전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2004 |
