Browse by Subject INTERFACIAL MICROSTRUCTURE

Showing results 1 to 3 of 3

1
Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging

Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12

2
Fabrication and mechanical properties of carbon fiber/epoxy nanocomposites containing high loadings of noncovalently functionalized graphene nanoplatelets

Kim, Joonhui; Cha, Jaemin; Chung, Bongjin; Ryu, Seongwoo; Hong, Soon H., COMPOSITES SCIENCE AND TECHNOLOGY, v.192, 2020-05

3
Thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003

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