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Showing results 1 to 2 of 2

1
Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; Park, Hyunwook; Park, Junyong; Lee, Seongsoo; Shim, Daeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09

2
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05

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