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Showing results 1 to 5 of 5

1
A study on the thermal fatigue behavior of solder joints under power cycling conditions

Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03

2
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08

3
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007

4
Shear-strain-mediated photoluminescence manipulation in two-dimensional transition metal dichalcogenides

Hwang, Hyeong-Yong; Lee, Sehyuk; Kim, Yong-Hoon; Ullah, Farman; Le, Chinh Tam; Kim, Yong Soo; Yee, Ki-Ju; et al, 2D MATERIALS, v.9, no.1, pp.015011, 2022-01

5
Triangular plate-bending elements by combined node with improved non-conforming modes and substitute shear strain fields = 개선된 비적합 변위형과 대체전단 변형률장을 가진 절점 병합 삼각형 평판휨요소link

Kang, Yun-Sook; 강윤숙; et al, 한국과학기술원, 2003

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