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Showing results 1 to 3 of 3

1
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10

2
Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems

Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08

3
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08

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