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A novel description of thermomechanical behavior using a rheological model Lee, KO; Hong, SG; Lee, Soon-Bok, FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.306-308, pp.205 - 210, 2006 |
Enhanced elevated-temperature performance of Li(Ni0.8Co0.15Al0.05)O-2 electrodes coated with Li2O-2B(2)O(3) glass Lim, Sungnam; Ahn, Wook; Yeon, Sun-Hwa; Park, SeungBin, ELECTROCHIMICA ACTA, v.136, pp.1 - 9, 2014-08 |
Fabrication of 50-nm gate SOI n-MOSFETs using novel plasma-doping technique Cho, WJ; Ahn, CG; Im, KJ; Yang, JH; Oh, Jihun; Baek, IB; Lee, S, IEEE ELECTRON DEVICE LETTERS, v.25, no.6, pp.366 - 368, 2004-06 |
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