Browse by Subject current carrying capacity1. IntroductionFlip chip technology has been widely used to meet the package requirements of increasing density and higher electrical performance for electro
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| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
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