Browse by Subject current carrying capacity1. IntroductionFlip chip technology has been widely used to meet the package requirements of increasing density and higher electrical performance for electro
Showing results 1 to 1 of 1
| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
Discover
Type
Open Access
Date issued
- 1 2040 - 2041
- 32,033 2020 - 2029
- 100,025 2010 - 2019
- 75,672 2000 - 2009
- 44,727 1990 - 1999
- 1,633 1970 - 1979
- 62 1964 - 1969