Browse by Subject coefficient of thermal expansion (CTE)
Showing results 1 to 2 of 2
| Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
| Feasibility Study to Actively Compensate Deformations of Composite Structure in a Space Environment Farinelli, Ciro; Kim, Hong-Il; Han, Jae-Hung, INTERNATIONAL JOURNAL OF AERONAUTICAL AND SPACE SCIENCES, v.13, no.2, pp.221 - 228, 2012-06 |
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