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Showing results 1 to 2 of 2

1
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

2
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11

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