Browse by Subject THERMAL-STRESSES
Showing results 1 to 3 of 3
| Application of stress intensity to design of anisotropic/isotropic bi-materials with a wedge Shin, KC; Kim, WS; Lee, Jungju, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.44, no.24, pp.7748 - 7766, 2007-12 |
| Chip warpage model for reliability prediction of delamination failures Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04 |
| Evaluation of cryogenic performance of adhesives using composite-aluminum double-lap joints Kang, Sang-Guk; Kim, Myung-Gon; Kim, Chun-Gon, COMPOSITE STRUCTURES, v.78, no.3, pp.440 - 446, 2007-05 |
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