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Showing results 1 to 9 of 9

1
A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards

Kim, Myunghoi; Ahn, Seungyoung, APPLIED SCIENCES-BASEL, v.7, no.8, 2017-08

2
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08

3
Electromagnetic Shielding Analysis of Multiple Slits on a Metal Plate Coated With a Ferrite Sheet

Park, Hyun Ho; Kwon, Jong Hwa; Kwak, Sang Il; Ahn, Seungyoung, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.5, pp.1448 - 1455, 2016-10

4
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12

5
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06

6
Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09

7
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10

8
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

9
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

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