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Showing results 1 to 5 of 5

1
Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03

2
Energy-Efficient Symmetric BC-BCH Decoder Architecture for Mobile Storages

Hwang, Seokha; Moon, Seungsik; Jung, Jaehwan; Kim, Daesung; Park, In-Cheol; Ha, Jeongseok; Lee, Youngjoo, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS-I: REGULAR PAPERS, v.66, no.11, pp.4462 - 4475, 2019-11

3
GCMix: An Efficient Data Protection Scheme against the Paired Page Interference

Kim, Sang-Hoon; Lee, Jinhyuk; Kim, Jin-Soo, ACM TRANSACTIONS ON STORAGE, v.13, no.4, 2017-12

4
Low-Power Parallel Chien Search Architecture Using a Two-Step Approach

Yoo, Hoyoung; Lee, Youngjoo; Park, In-Cheol, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.63, no.3, pp.269 - 273, 2016-03

5
Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum

Lee, Eung Chang; Rho, Jinsung; Kang, Heeyoub; Lee, Bong Jae, IEEE ELECTRON DEVICE LETTERS, v.39, no.12, pp.1908 - 1911, 2018-12

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