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Parameter Optimization of Foldable Flapping-Wing Mechanism for Maximum Lift Yang, Hyeon-Ho; Lee, Sang-Gil; Akoto, Reynolds Addo; Han, Jae-Hung, JOURNAL OF MECHANISMS AND ROBOTICS-TRANSACTIONS OF THE ASME, v.16, no.3, 2024-03 |
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12 |
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