Browse by Author Suk, Kyoung-Lim
Showing results 1 to 15 of 15
| A study on the effects of nanofiber anisotropic conductive adhesive (Nanofiber ACA) properties on fine pitch interconnection stability of ACA flip-chip assemblies = 나노파이버 이방성 전도 접착제 특성이 미세피치 플립칩 어셈블리의 접속 안정성에 미치는 영향에 대한 연구link Suk, Kyoung-Lim; 석경림; et al, 한국과학기술원, 2013 |
| Effects of nanofiber materials of nanofiber anisotropic conductive adhesives (nanofiber ACAs) for ultra-fine pitch electronic assemblies Suk, Kyoung-Lim; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.118 - 123, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
| Effects of Nanofiber on the Electrical Properties of Anisotropic Conductive Adhesives (ACAs) Suk, Kyoung-Lim; Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.1, pp.351 - 355, 2013-01 |
| Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Microsolder Ball Incorporated Nanofiber Anisotropic Conductive Adhesives (Microsolder/Nanofiber ACAs) Suk, Kyoung-Lim; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.162 - 169, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-28 |
| Nanofiber Anisotropic Conductive Film (ACF) Containing Insulated Conductive Particle (ICP) for Improving Insulation Property of Fine Pitch Chip-on-Glass (COG) Assembly Lee, Sang Hoon; Suk, Kyoung-Lim; Paik, Kyung-Wook, EMAP 2013 (15th International Conference on Electronic Materials and Packaging), EMAP 2013 (15th International Conference on Electronic Materials and Packaging), 2013-10-06 |
| Nanofiber Incorporated Anisotropic Conductive Adhesives (ACAs) for Fine Pitch Electronic Packaging Applications Suk, Kyoung-Lim; Paik, Kyung-Wook, Electrospin 2012, 2012-05 |
| Novel Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Electronic Package Application Suk, Kyoung-Lim; Paik, Kyung-Wook, Nano Korea Symposium, 2011-08 |
| Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications Suk, Kyoung-Lim; Paik, Kyung-Wook, TechConnect World presents Nanotech 2011, 2011-06 |
| Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06 |
| Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method Lee, Sang-Hoon; Suk, Kyoung-Lim; Lee, Ki-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2108 - 2114, 2012-12 |
| Study on flexible packages using thin chips with pre-applied anisotropic conductive films (ACFs) = 이방성 전도 필름이 미리 도포되어 있는 박형 칩을 사용한 플렉서블 패키지에 관한 연구link Suk, Kyoung-Lim; 석경림; et al, 한국과학기술원, 2009 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
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