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Showing results 1 to 8 of 8

1
Analysis of Rayleigh calibration signal for 2015 KSTAR Thomson scattering system

Oh, TS; Kim, KH; Lee, JH; Lee, SH; Ghim, Young chul, KSTAR Conference 2016, National Fusion Research Institute, 2016-02-24

2
Density calibration using Rayleigh scattering for 2015 KSTAR Thomson system

Oh, TS; Kim, KH; Park, KR; Lee, JH; Lee, SH; Kim, YC, Korean Physics Society Spring Conference, Korean Physics Society, 2016-04-22

3
Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV)

Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; et al, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29

4
Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

Kim, SY; Oh, TS; Lee, Won-Jong; Kim, YH, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26

5
Quantifying noise sources in the KSTAR 2014 Thomson Scattering system from the measured variation on electron temperature

Oh, TS; Kim, K; Lee, JH; Lee, SH; Scannell, R; Field, AR; Cho, K; et al, JOURNAL OF INSTRUMENTATION, v.11, 2016-03

6
Relaxation of quasi-static approach via polynomial interpolation in the predictor corrector quasi-static method

Oh, TS; Kim, Yonghee, Transactions of the American Nuclear Society, ANS 2020, pp.734 - 737, American Nuclear Society, 2020-06

7
The Crystalline quality of InxAl1-xAs layers on lnP grown by molecular beam epitaxy at 520 degrees C

Choi, JS; Oh, TS; Choo, Woong Kil, JOURNAL OF MATERIALS SCIENCE, v.35, no.3, pp.655 - 660, 2000-02

8
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05

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