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Showing results 1 to 2 of 2

1
Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

Jing, Xinyi; Luo, Keyu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.26, pp.1663 - 1668, 2023-09

2
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11

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