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Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM Lu M.; Lauro P.; Shih D.-Y.; Polastre R.; Goldsmith C.; Henderson D.W.; Zhang H.; et al, 2008 58th Electronic Components and Technology Conference, ECTC, pp.360 - 365, 2008-05-27 |
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders Lu M.; Shih D.-Y.; Lauro P.; Kang S.; Goldsmith C.; Seo S.-K., 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.922 - 929, 2009-05-26 |
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