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Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
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