Browse by Subject equivalent circuit model

Showing results 7 to 8 of 8

7
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

8
TiN/PECVD-Si3N4/TiN diaphragm-based capacitive-type MEMS acoustic sensor

Lee, Jae Woo; Jeon, J. H.; Kim, Y. G.; Lee, S. Q.; Yang, W. S.; Lee, Jungsoo; Lee, Sang-Gug, ELECTRONICS LETTERS, v.52, no.6, pp.468 - 469, 2016-03

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