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Showing results 7 to 9 of 9

7
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10

8
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

9
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

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