Showing results 5 to 9 of 9
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10 |
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12 |
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08 |
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