Browse by Subject T-stress
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| Finite element analysis of quasistatic crack propagation in brittle media with voids or inclusions Sohn, Dong-Woo; Lim, Jae-Hyuk; Cho, Young-Sam; Kim, Jeong-Ho; Im, Se-Young, JOURNAL OF COMPUTATIONAL PHYSICS, v.230, no.17, pp.6866 - 6899, 2011-07 |
| 웨이퍼 접합 시험에서의 파괴역학적 응용 연구 = An application of fracture mechanics to wafer bonding testlink 문호정; Moon, Ho-Jeong; et al, 한국과학기술원, 1998 |
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