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Showing results 87761 to 87780 of 100569

87761
Vulnerabilities of network OS and mitigation with state-based permission system

Noh, Jiseong; Lee, Seunghyeon; Park, Jaehyun; Shin, Seungwon; Kang, Brent Byunghoon, SECURITY AND COMMUNICATION NETWORKS, v.9, no.13, pp.1971 - 1982, 2016-09

87762
Vulnerability Analysis of Evacuation Transportation Networks

Kim, Jun; Lee, Je-Hun; Kim, Hyunjung; Chung, Byung Do, INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICE, v.25, no.5, pp.663 - 673, 2018

87763
Vulnerability of an RFID authentication protocol proposed in at SecUbiq 2005

Kwon, Daesung; Han, Daewan; Lee, Jooyoung; Yeom, Yongjin, LECTURE NOTES IN COMPUTER SCIENCE, v.4097, pp.262 - 270, 2006

87764
Vulnerability-Based Critical Neurons, Synapses, and Pathways in the Caenorhabditis elegans Connectome

Kim, Seongkyun; Kim, Hyoungkyu; Kralik, Jerald D.; Jeong, Jaeseung, PLOS COMPUTATIONAL BIOLOGY, v.12, no.8, 2016-08

87765
VUV spectroscopy in impurity injection experiments at KSTAR using prototype ITER VUV spectrometer

Seon, C. R.; Hong, Joohwan; Song, Inwoo; Jang, Juhyeok; Lee, H. Y.; An, Y. H.; Kim, B. S.; et al, REVIEW OF SCIENTIFIC INSTRUMENTS, v.88, no.8, pp.083511, 2017-08

87766
VXQ: A visual query language for XML data

Choi, Ryan H.; Wong, Raymond K., INFORMATION SYSTEMS FRONTIERS, v.17, no.4, pp.961 - 981, 2015-08

87767
W 에 의한 Mo 치환이 850℃ 에서 시효된 이상 스테인레스강의 취화 특성에 미치는 영향

김상범; 백경욱; 김영길, 대한금속·재료학회지, v.35, no.12, pp.1593 - 1601, 1997-12

87768
W(CO)5(L)-Catalyzed Endo-Selective Cyclization of Allenyl Silyl Enol Ethers: An Efficient Method for the Cyclopentene Annulation onto a,b-Unsaturat

Kim, Sung Gak, ORGANIC LETTERS, v.5, no.10, pp.1725 - 1728, 2003-05

87769
(W,Ti)C계 초경합금의 미세조직 및 경도에 미치는금속 결합재 조성의 영향

Walid M. Daoush; 이경호; 박희섭; 장종준; 홍순형, 한국분말야금학회지, v.14, no.3, pp.208 - 214, 2007-06

87770
W-Band Compact Balun-Embedded SPDT Switch With Leakage-Canceled Overlapped Transformers

Lee, Seungchan; Park, Jinseok; Hong, Songcheol, IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS, v.33, no.11, pp.1532 - 1535, 2023-11

87771
W-incorporated CoMo/gamma-Al2O3 hydrodesulfurization catalyst .1. Catalytic activities

Lee, DK; Lee, IC; Park, SK; Bae, SY; Woo, Seong-Ihl, JOURNAL OF CATALYSIS, v.159, no.1, pp.212 - 218, 1996-03

87772
W-incorporated CoMo/gamma-Al2O3 hydrodesulfurization catalyst .2. Characterization

Lee, DK; Lee, HT; Lee, IC; Park, SK; Bae, SY; Kim, CH; Woo, Seong-Ihl, JOURNAL OF CATALYSIS, v.159, no.1, pp.219 - 229, 1996-03

87773
W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거

홍성현; 강석중; 윤덕용, 대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01

87774
W0.5TaTiVCr-based composite reinforced with W-mesh for fusion plasma-facing applications

Waseem, Owais Ahmed; Ryu, Ho Jin, FUNCTIONAL COMPOSITES AND STRUCTURES, v.2, no.1, pp.015004, 2020-03

87775
Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations

Yu, Tae-Sun; Lee, Tae-Eog, INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, v.58, no.2, pp.434 - 447, 2020-01

87776
Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types

Ko, Sung-Gil; Yu, Tae-Sun; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.18, no.3, pp.1516 - 1526, 2021-07

87777
Wafer distribution system for a clean room using a novel magnetic suspension technique

Park, KH; Ahn, KY; Kim, Soohyun; Kwak, Yoon Keun, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.3, no.1, pp.73 - 78, 1998-03

87778
Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정

배귀남; 박승오; 이춘식; 명현국; 신흥태, 설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05

87779
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

87780
Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

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