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Showing results 82861 to 82880 of 100597
| Thermal and structural analysis of a polymer bilayer film as an erasable optical material Jung, HeeTae, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.64, no.1, pp.12 - 18, 1999 |
| Thermal annealing effects on the photoluminescence of InGaN/GaN quantum wells Lee, WH; Kim, KS; Yang, GM; Hong, CH; Lim, KY; Suh, EK; Lee, HJ; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.39, no.1, pp.136 - 140, 2001-07 |
| Thermal annealing induced bicontinuous networks in bulk heterojunction solar cells and bipolar field-effect transistors Kong, Ho-Youl; Moon, Ji-Sun; Cho, Nam-Sung; Jung, In-Hwan; Park, Moo-Jin; Park, Jong-Hwa; Cho, Shin-Uk; et al, APPLIED PHYSICS LETTERS, v.95, no.17, pp.173301-1 - 173301-3, 2009-10 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films 이인화; 김택수, 마이크로전자 및 패키징학회지, v.21, no.1, pp.41 - 44, 2014-03 |
| Thermal behavior of alkali-activated fly ash/slag with the addition of an aerogel as an aggregate replacement Seo, Joonho; Bae, S. J.; Jang, DaeIk; Park, Solmoi; Yang, Beomjoo; Lee, Haeng-Ki, CEMENT & CONCRETE COMPOSITES, v.106, pp.103462, 2020-02 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi, S, COMPOSITE STRUCTURES, v.47, no.1-4, pp.695 - 703, 1999-12 |
| Thermal Buckling Characteristics of Composite Conical Shell Structures Woo, Ji-Hye; Rho, Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.8, no.2, pp.82 - 88, 2007-11 |
| Thermal buckling of laminated composite beams with embedded shape memory alloy actuators Choi, S; Lee, Jungju; Lee, DC, JOURNAL OF COMPOSITE MATERIALS, v.34, no.18, pp.1529 - 1547, 2000 |
| THERMAL C-O BOND SCISSION IN A MU-3-ETA-2-COORDINATED ACYL - STRUCTURAL CHARACTERIZATION OF A DOUBLY BRIDGING 4-ELECTRON OXO LIGAND SHAPLEY, JR; Park, Joon Taik; CHURCHILL, MR; ZILLER, JW; BEANAN, LR, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.106, no.4, pp.1144 - 1145, 1984 |
| Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
| Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
| Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
| Thermal characteristics of optical gain for GaInNAs quantum wells at 1.3 mu m Kim, CK; Lee, Yong-Hee, APPLIED PHYSICS LETTERS, v.79, no.19, pp.3038 - 3040, 2001-11 |
| Thermal characteristics of organoclay and their effects upon the formation of polypropylene/organoclay nanocomposites Lee, JW; Lim, YT; Park, OOk, POLYMER BULLETIN, v.45, no.2, pp.191 - 198, 2000-09 |
| Thermal characteristics of perforated self-rotating twisted tapes in a double-pipe heat exchanger Zhang, Shaojie; Lu, Lin; Dong, Chuanshuai; Cha, Seung Hyun, APPLIED THERMAL ENGINEERING, v.162, 2019-11 |
| Thermal characteristics of the spindle bearing system with a gear located on the bearing span Choi, JK; Lee, Dai Gil, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.38, no.9, pp.1017 - 1030, 1998-09 |
| Thermal characteristics of tubular single lap adhesive joints under axial loads Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.15, no.12, pp.1511 - 1528, 2001 |
| Thermal characterization and optimization of pulsating heat pipes operating in a circulation mode Noh, Hyung Yun; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.115, pp.1234 - 1246, 2017-12 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
| Thermal Compatibility of Centrifugally Atomized U-Mo Powders with Al in a Dispersion Fuel Paik, Kyung-Wook; Kim, Ki-Hwan; Lee, Don Bae; Kim, Chang Kyu; Hofman, GL, NUCLEAR ENGINEERING AND DESIGN, v.178, no.1, pp.111 - 117, 1997-12 |
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