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| Mean-Shift의 색 수렴성과 모양 기반의 재조정을 이용한 실시간 머리 추적 알고리즘 대전; 대전; 대전; 대전, 전자공학회논문지 - SP, v.42, no.6, pp.771 - 778, 2005-11 |
| Mean-Variance Optimization for Asset Allocation Kim, Jang Ho; Lee, Yongjae; Kim, Woo Chang; Fabozzi, Frank J., JOURNAL OF PORTFOLIO MANAGEMENT, v.47, no.5, pp.24 - 40, 2021-05 |
| Meaningful scene filtering for TV terminals Jin, SH; Cho, JH; Ro, YongMan, IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, v.52, pp.263 - 268, 2006-02 |
| Means-ends and whole-part traceability analysis of safety requirements Lee J.-S.; Katta V.; Jee, Eunk Young; Raspotnig C., JOURNAL OF SYSTEMS AND SOFTWARE, v.83, no.9, pp.1612 - 1621, 2010 |
| Measuerment Signal Selection and a Simultaneous State and Input Observer Stein J. L.; Park, Youngjin, JOURNAL OF DYNAMIC SYSTEMS MEASUREMENT AND CONTROL-TRANSACTIONS OF THE ASME, v.110, no.2, pp.166 - 173, 1988-06 |
| Measure of Nonlinear Dynamical Dissimilarity for Multichannel EEG Analysis Seung-Hyun Jin; Kim, Soo Yong, INTERNATIONAL JOURNAL OF NEUROSCIENCE, 2008 |
| Measured results on symmetric dual-level spiral inductors for RF ICs Lee, Sang-Gug; Shin, SB; Ihm, GJ, IEICE TRANSACTIONS ON ELECTRONICS, v.E84C, no.6, pp.845 - 848, 2001-06 |
| Measurement of Thermal Conductivities of SiN and TbFeCo Fiims Kim, Seong-Sue; Ahn, Young-Man; Lee, Kymg-Gem; Gll, Byeang-Lyong; Shin, Sung-Chul, IEEE Transactions on Magnetics, Vol.32, No.5, 1996-09 |
| Measurement and Analysis for Determination of PCR of the CANDU6 Core Kim, Jaeha; Motalab, Mohammad Abdul; Kim, Yonghee; Kim, Gwangsoo, Nuclear Technology, v.201, no.2, pp.138 - 154, 2018-01 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Measurement and Analysis of a High-Speed TSV Channel Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Myung-Hoi; Kim, Ki-Yeong; Lee, Jun-Ho; Lee, Hyung-Dong; Park, Kun-Woo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.10, pp.1672 - 1685, 2012-10 |
| Measurement and analysis of electron-neutral collision frequency in the calibrated cutoff probe You, KH; You, SJ; Kim, DW; Na, Byungkeun; Seo, BH; Kim, JH; Chang, Hongyoung, PHYSICS OF PLASMAS, v.23, no.3, pp.033509, 2016-03 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| MEASUREMENT AND ANALYSIS OF HEAT-TRANSFER AND FRICTION DURING HOT-FORGING Burte, P.R.; Im, Yong-Taek; Altan, T.; Semiatin, S.L., JOURNAL OF ENGINEERING FOR INDUSTRY-TRANSACTIONS OF THE ASME, v.112, no.4, pp.332 - 339, 1990-11 |
| Measurement and analysis of single-hop delay on an IP backbone network Papagiannaki, K; Moon, Sue Bok; Fraleigh, C; Thiran, P; Diot, C, IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS, v.21, no.6, pp.908 - 921, 2003-08 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Measurement and Application of Creep Properties S. W. Nam, 대한금속학회회보, v.10, no.3, pp.233 - 246, 1997 |
| Measurement and calculation of optical band gap of chromium aluminum oxide films Kim, E; Jiang, ZT; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.8, pp.4820 - 4825, 2000-08 |
| Measurement and characterization of soft tissue behavior with surface deformation and force response under large deformations Ahn, Bum-Mo; Kim, Jung, MEDICAL IMAGE ANALYSIS, v.14, no.2, pp.138 - 148, 2010-04 |
| Measurement and Characterization of the Moisture-Induced Properties of ACF Package Yoon, Ji-Young; Kim, Ilho; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.131, no.2, pp.0210121 - 0210128, 2009-06 |
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