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Showing results 41461 to 41480 of 100223
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-Frequency Ignition Characteristics in a 4-Valve SI Engine with Tumble-Swirl Flows Bae, Choong-Sik; Lee, JS; Ha, JY, SAE Technical Paper 981433, no.1370, pp.1 - 8, 1998-05 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency on-chip inductance model Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12 |
| HIGH-FREQUENCY RESONANT AC/DC RECTIFIER WITH UNITY POWER-FACTOR CHOI, HC; HAN, JW; Youn, Myung Joong, ELECTRONICS LETTERS, v.28, no.17, pp.1592 - 1594, 1992-08 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| High-frequency seismic response during permeability reduction due to biopolymer clogging in unconsolidated porous media Kwon, Tae-Hyuk; Ajo-Franklin, Jonathan B., GEOPHYSICS, v.78, no.6, pp.117 - 127, 2013-11 |
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
| High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03 |
| High-frequency transverse combustion instabilities of lean-premixed multislit hydrogen-air flames Lee, Taesong; Kim, Kyu Tae, COMBUSTION AND FLAME, v.238, no.4, 2022-04 |
| High-gain coefficient long-wavelength-band erbium-doped fiber amplifier using 1530-nm band pump Choi, BH; Park, HyoHoon; Chu, M; Kim, SK, IEEE PHOTONICS TECHNOLOGY LETTERS, v.13, no.2, pp.109 - 111, 2001-02 |
| High-Gain Wide-Bandwidth Capacitor-Less Low-Dropout Regulator (LDO) for Mobile Applications Utilizing Frequency Response of Multiple Feedback Loops Hong, Sung Wan; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.63, no.1, pp.46 - 57, 2016-01 |
High-harmonic generation by field enhanced femtosecond pulses in metal-sapphire nanostructure Han, Seunghwoi; Kim, Hyunwoong; Kim, Yong Woo; KIM, Young-Jin; Kim, Seungchul; Park, In-Yong; Kim, Seung-Woo, NATURE COMMUNICATIONS, v.7, 2016-10 |
| High-harmonic generation by resonant plasmon field enhancement Kim, Seung-Chul; Jin, Jong-Han; KIM, Young-Jin; Park, In-Yong; Kim, Yun-Seok; Kim, Seung-Woo, NATURE, v.453, no.7196, pp.757 - 760, 2008-06 |
| High-impulse, low-power, digital microthruster using low boiling temperature liquid propellant with high viscosity fluid plug Kang T.G.; Kim S.W.; Cho, Young-Ho, SENSORS AND ACTUATORS, A: PHYSICAL, v.97-98, pp.659 - 664, 2002-04 |
| High-Intensity Aerobic Exercise Suppresses Cancer Growth by Regulating Skeletal Muscle-Derived Oncogenes and Tumor Suppressors Jee, Hyunseok; Park, Eunmi; Hur, Kyunghoon; Kang, Minjeong; Kim, Yoosik, FRONTIERS IN MOLECULAR BIOSCIENCES, v.9, 2022-06 |
| High-k HfxZr1-xO2 Ferroelectric Insulator by Utilizing High Pressure Anneal Das, Dipjyoti; Jeon, Sanghun, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.6, pp.2489 - 2494, 2020-06 |
| High-Level Architecture service management for the interoperation of federations Yoo, Min Wook; Choi, Changbeom; Kim, Tag-Gon, SIMULATION-TRANSACTIONS OF THE SOCIETY FOR MODELING AND SIMULATION INTERNATIONAL, v.91, no.6, pp.566 - 590, 2015-06 |
| High-level conversion of L-lysine into 5-aminovalerate that can be used for nylon 6,5 synthesis Park, Si Jae; Oh, Young Hoon; Noh, Won; Kim, Hye Young; Shin, Jae-Ho; Lee, Eun Gyo; Lee, Seungwoon; et al, BIOTECHNOLOGY JOURNAL, v.9, no.10, pp.1322 - 1328, 2014-10 |
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