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Showing results 29341 to 29360 of 276546
| Analysis of mass concrete structures with concrete properties by thermal stress device - part II: verification Cha, Sang-Lyul; Jin, Seung-Seop; Kim, Jin-Keun, MAGAZINE OF CONCRETE RESEARCH, v.72, no.8, pp.392 - 411, 2020-04 |
| Analysis of Measured Single-Hop Delay from an Operational Backbone Network Papagiannaki, Konstantina; Moon, Sue Bok; Fraleigh, Chuck; Thiran, Patrick; Tobagi, Fouad A.; Diot, Christophe, 21st Annual Joint Conference of the IEEE-Computer-and-Communications-Societies, pp.533 - 544, IEEE Communications Society, 2002-06 |
| Analysis of mechanical behavior of ultra-fine Au wires by micro-tensile test technique Hong, Soon Hyung, pp.82 - 92, 2002-01-01 |
| Analysis of Mechanical Characteristics of Polymer Sandwich Panels Containing Injection Molded and 3D Printed Pyramidal Kagome Cores Yang, K. M.; Park, J. H.; Choi, T. G.; Hwang, J. S.; Yang, Dong-Yol; Lyu, M. -Y., ELASTOMERS AND COMPOSITES, v.51, no.4, pp.275 - 279, 2016-12 |
| Analysis of Mechanical Joint in Composite Cylinder Hong, Chang Sun, Proc. of the 30th Aircraft Symposium, pp.236 - 239, 1992 |
| Analysis of Mechanical Properties Degradation of Li[NixCoyMnz]O2 Cathode for Li-ion batteries 한승민, 대한금속재료학회 2016춘계, 대한금속재료학회, 2016-04-28 |
| Analysis of Mechanical Properties Degradation of Li[NixCoyMnz]O2 Cathode for Li-ion batteries Han, Seung Min Jane, 대한금속재료학회 2016 춘계, 대한금속재료학회, 2016-04-28 |
| Analysis of mechanical properties for biofilm in a microfluidic device (poster) Lim, Seongjin; Kim, Seunggyu; Jeon, Jessie Sungyun, 대한기계학회 2016년도 학술대회, 대한기계학회, 2016-12-14 |
| Analysis of Mechanical Properties of Polymer ABC by Atomic Force Microscopy 김성철, 한국고분자학회 추계발표회, 2005 |
| Analysis of mechanism of contaminant removal from a bottom river cavity Chang, K.S.; Constantinescu, G.; Park, Seung O, World water and environmental resources congress, 2006-05 |
| Analysis of Medical Devices EMC Problems due to Leakage Magnetic Field generated in Wireless Charging System of Electric Vehicle Rhee, Jaewon; Ahn, Jangyong; Kim, Haerim; Lee, Changmin; Ahn, Seungyoung, 35th General Assembly and Scientific Symposium of the International Union of Radio Science, URSI GASS 2023, Institute of Electrical and Electronics Engineers Inc., 2023-08-25 |
| Analysis of medium access delay and packet overflow probability in IEEE 802.11 networks Hwang, Gang Uk, 7th International Conference on Next Generation Teletraffic and Wired/Wireless Advanced Networking, NEW2AN 2007, pp.419 - 430, NEW2AN'07, 2007-09-10 |
| Analysis of Melting at the Wall in Laminar Flow in a Cylindrical Channel Chun, Moon Hyun; sung-jae cho, INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, v.17, no.4, pp.443 - 454, 1990 |
| Analysis of melting at the wall in laminar flow in a cylindrical channel = 층류 유동에 의한 원통형 유로 벽면 용융 해석link Cho, Sung-Jae; 조성제; et al, 한국과학기술원, 1991 |
| Analysis of Melting at the Wall in Laminar Flowin a Cylindrical Channel 전문헌, 한국원자력학회 '93 춘계학술발표회 논문집 (I), pp.383 - 394, 1990 |
| Analysis of Melting Phenomena of a Circular Tube Geometry for Applications in an HCDA of an LMFBR 전문헌, 한국원자력학회 춘계학술발표회 논문초록집, pp.25 - 27, 1984 |
| Analysis of metabolic regulome for colorectal cancer prognosis = 대사 조절체 분석을 통한 대장암 예후 예측 분석link Lee, Sunjae; 이선재; et al, 한국과학기술원, 2015 |
| Analysis of metal transfer through equilibrium shape of pendant drop in GMAW S.K. Choi; K.H. Lee; C.D. Yoo; T.S. Lee, YOSETSU GAKKAI RONBUNSHU/QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, v.14, no.2, pp.243 - 247, 1996-04 |
| Analysis of metal-interlaced-grating vertical-cavity surface-emitting lasers using the modal method by modal expansion Ju, YG; Ser, JH; Lee, Yong-Hee, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.33, no.4, pp.589 - 595, 1997-04 |
| Analysis of Methodology of Breakpoint Detection Method for 22.9kV Submarine Power cable based on the Time Domain Reflectometer (TDR) Kim, Hyunwoong; Lee, Sanguk; Joung, Jong-Man; Park, Bumjin; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.191 - 195, Institute of Electrical and Electronics Engineers Inc., 2023-08 |
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