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| Thermal stability of superconductors with large surface barriers to flux entry: Superconducting power‐line conductors Kim, Sehun; Howard, R.E; Beasley, M.R, JOURNAL OF APPLIED PHYSICS, v.49, no.2, pp.730 - 735, 1978-02 |
| Thermal stability of surface functionalized celluloseceramic based composite separator = 표면 기능화 셀룰로오스-세라믹 복합 분리막의 열적 안정성에 관한 연구link QURESHI, YUSRA; Yuk, Jong Min; et al, 한국과학기술원, 2023 |
| Thermal stability of the exchanged biased CoFe/IrMn electrode for the magnetic tunnel junction as a function of CoFe thickness Lee, JH; Kim, SJ; Yoon, CS; Kim, CK; Park, Byong Guk; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.92, no.10, pp.6241 - 6244, 2002-11 |
| Thermal Stability of the Multiple Isoforms of Inulase from Aspergillus niger Uhm T. B.; Kwon Y. J.; Han S. B.; Byun, Si Myung, BIOTECHNOLOGY LETTERS, v.9, no.4, pp.287 - 290, 1987 |
| Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05 |
| Thermal stability study of BaAl2Si2O8 : Eu2+ phosphor using its polymorphism for plasma display panel application Im, WB; Kim, YI; Jeon, DukYoung, CHEMISTRY OF MATERIALS, v.18, no.5, pp.1190 - 1195, 2006-03 |
| Thermal stability study of Eu2+-doped BaAl2Si 2O8 phosphor using polymorphism for plasma display panel applications Im, WB; Kim, YI; Jeon, Duk Young, 5th International Meeting on Information Display, pp.1568 - 1571, Korean Information Display Society, 2005-07-19 |
| Thermal Stability Study of Eu2+-doped BaAl2Si2O8 Phosphor using its Polymorphism for Plasma Display Panel applications Jeon, Duk Young; Im, WB; Kim, YI, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.32 -, 2005 |
| Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05 |
| Thermal stabilization for accurate dimensional measurement using gallium Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06 |
| Thermal Stabilization of Aspergillus Phytase by L-Arginine Ryu, S; Park, Tae Gwan, BIOTECHNOLOGY AND BIOPROCESS ENGINEERING, v.3, no.0, pp.32 - 34, 1998-05 |
| Thermal Stable Flexible Vertical μLED Patch for Hair Growth Treatment Kim, Min Seo; LEE, JAEHEE; Lee, Keon Jae, The 23rd International Meeting on Information Display, The Korean Information Display Society, 2023-08-24 |
| Thermal Storage Materials and Heat Transfer Characteristics in A Termal Energy Storage System 김상돈, Proc. of Spring Annual Meeting of Solar Energy Society, pp.2 - 3, 1990 |
| Thermal stress analysis in structural elements of HRSG casing Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012 |
| Thermal stress analysis of silo in radioactive waste repository considering construction conditions Cha, Sang Lyul; Lee, Yun; Kim, Jin-Keun, NUCLEAR ENGINEERING AND DESIGN, v.322, pp.412 - 426, 2017-10 |
| Thermal stress and fatigue analysis of exhaust manifold Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004 |
| Thermal stress in silica-on-silicon disk resonators Chen, Tong; Lee, Hansuek; Vahala, Kerry J., APPLIED PHYSICS LETTERS, v.102, no.3, 2013-01 |
| Thermal Stress Simulation of Mass Concrete Using Thermal Stress Device Kim, Jin-Keun; Amin, MuhammadNasir, 2006 한국콘크리트학회 봄 학술대회, pp.474 - 477, 한국콘크리트학회, 2006-05-11 |
| Thermal Studies of Polymer Electrolytes Based on Poly(oligo[oxyethylene]oxysebacoyl) Park, Jung-Ki; Kim, DW; Lee, YG, 50th Annual Calorimetry Conference, pp.0 - 0, 1995-07-01 |
| Thermal suppression of high-repetition rate SBS pulse compression in liquid media Wang, Hongli; Cha, Seongwoo; Kong, Hong jin; Wang, Yulei; Lu, Zhiwei, OPTICS EXPRESS, v.30, no.21, pp.38995 - 39013, 2022-10 |
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