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| Thermal crack initiation of high alloy steel slab after continuous casting process through finite element analysis Lee, Yong Seok; Kim, Seong Woo; Lee, You Ho; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| THERMAL CREEP CORRELATIONS OF FERRITIC/MARTENSITIC STEELS FOR ADVANCED NUCLEAR REACTORS Ryu, Ho Jin; Kim, YS; Yacout, AM; Hofman, GL, The Sixth Pacific Rim International Conference on Advanced Materials and Processing, PRICM, 2007-11 |
| Thermal creep modeling of HT9 steel for fast reactor applications Ryu, Ho Jin; Kim, Yeon Soo; Yacout, A. M., JOURNAL OF NUCLEAR MATERIALS, v.409, no.3, pp.207 - 213, 2011-02 |
| Thermal Creep of a Rarefied Gas on the Basis of Non-linear Korteweg-Theory Kim, Yong-Jung; Lee, Min Gi; Slemrod, Marshall, ARCHIVE FOR RATIONAL MECHANICS AND ANALYSIS, v.215, no.2, pp.353 - 379, 2015-02 |
| Thermal CVD에 의해 제조된 carbon nanotube의 구조과 수소 저장 특성에 관한 연구 = A study on the structure and hydrogen storage properties of carbon nanotubes prepared by thermal CVDlink 한규성; Han, Kyu-Sung; 강정구; 이재영; et al, 한국과학기술원, 2005 |
| Thermal Cycling Effect on the Mechanical Properties of AISI 4340 Steel H.S. Kim; C.H. Kim, 대한금속학회지, v.20, no.8, pp.696 - 702, 1982-08 |
| THERMAL CYCLING EFFECTS ON THE BIOREACTOR PERFORMANCES OF IMMOBILIZED BETA-GALACTOSIDASE IN TEMPERATURE-SENSITIVE HYDROGEL BEADS park, tae gwan; Hoffman, A.S, ENZYME AND MICROBIAL TECHNOLOGY, v.15, no.6, pp.476 - 482, 1993 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal cycling 열처리 가 AISI 4330강 의 현미경조직 과 기계적성질 에 미치는 효과 에 대한 연구 J.S. Chun, JOURNAL OF THE KOREAN INSTITUTE OF METALS, v.19, no.3, pp.208 - 217, 1981 |
| Thermal cycling 열처리가 A.I.S.I. 4340강의 피로 균열 성장에 미치는 영향 = Effect of thermal cycling heat treatment on fatigue crack growth in A.I.S.I. 4340 steellink 이형근; Lee, Hyung-Geun; et al, 한국과학기술원, 1981 |
| Thermal cycling 이 $MmNi_{4.5}Al_{0.5}$ 및 $MmNi_{4.15}Fe_{0.85}$의 수소화 반응 특성에 미치는 영향에 관한 연구 = A study on the changes of hydrogenation properties induced by thermal cyclings in $MmNi_{4.5}Al_{0.5}$ and $MmNi_{4.15}Fe_{0.85}$link 김근홍; Kim, Geun-Hong; 이재영; 이채우; et al, 한국과학기술원, 1986 |
| Thermal deactivation of MgCl2/THF/TiCl4 bimetallic complex catalyst in ethylene polymerization Choi, HG; Woo, Seong-Ihl, 2nd EurAsia Conf. on Chemistry, pp.391 - 392, 1990 |
| Thermal decomposition and deformation of dye and polycarbonate in compact disc-recordables Huh, YJ; Kim, SH; Kim, Sung Chul, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.12A, pp.7233 - 7238, 1997-12 |
| Thermal Decomposition and Spectroscopic Studies of Preheated Ammonia Borane Zhang, Junshe; Zhao, Yu; Akins, Daniel L.; Lee, Jae Woo, JOURNAL OF PHYSICAL CHEMISTRY C, v.114, no.45, pp.19529 - 19534, 2010-11 |
| Thermal decomposition kinetics of ammonium uranyl carbonate Kim, E.H.; Park, J.J.; Park, J.H.; Chang, I.S.; Choi, C.S.; Kim, Sang Done, JOURNAL OF NUCLEAR MATERIALS, v.209, no.3, pp.294 - 300, 1994 |
| Thermal Decomposition Kinetics of AUC 김상돈, Proc. of Korea Nuclear Energy Society Autumn Annual Meeting, 1990 |
| Thermal decomposition of Ru(EtCp)2 and metallorganic chemical vapor deposition of Ruthenium thin films using Ru(EtCp)2 No, Kwangsoo; Choi, Jong Wan; Hong, Jong In; Heo, Jung Shik; Moon, Sang Heup, 203rd Meeting of The Electrochemical Society, v.0, no.0, pp.0 - 0, ECS, 2003-04-28 |
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