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Showing results 124961 to 124980 of 276142
| Measurement of the voltage evolution on a load of X-pinch plasma system using the Pockels effect Choi, Seongmin; Ham, Seunggi; Ryu, Jonghyeon; Park, Sungbin; Kim, Jung-Hwa; Choi, YeongHwan; Chung, Kyoung-Jae; et al, JOURNAL OF INSTRUMENTATION, v.18, no.11, 2023-11 |
| Measurement of Thermal Coductivities on SiN and TbFeCo Films Kim, SS; Ahn, YM; Lee, KG; Gill, BL; Jang, YK; Shin, Sung-Chul, INTERMAG, pp.BS-05 -, 1996 |
| Measurement of thermal conductivities of SiN and TbFeCo films Kim, SS; Ahn, YM; Lee, KG; Gill, BL; Shin, Sung-Chul, IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.4095 - 1, 1996-09 |
| Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
| Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
| Measurement of Thermal Diffusion Parameters of Polystyrene Using a Thermal Field Flow Fractionation Method K.C. Song; E.K. Kim; I.J. Chung, THE KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.3, no.2, pp.171 - 175, 1986 |
| Measurement of thermal diffusivity of ion nitrided steel by flash method = 섬광 열확산 방법에 의한 이온 질화강의 열확산 계수 측정link Lee, Sang-Kil; 이상길; Lee, Chung-Oh; Lee, Hung-Joo; et al, 한국과학기술원, 1979 |
| Measurement of Thermal Diffusivity of Ion-Nitrided Steel by Flash Method, s.k.lee; h.j.lee; c.o.lee, 대한기계학회논문집, v.3, no.4, 1979 |
| Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate Lee, TI; Kim, C; Kim, MS; 김택수, 2014 KSPE Fall Meeting, KSPE, 2014-10-29 |
| Measurement of thermal expansion coefficient of poly-si using microgauge sensors Chae J.-H.; Lee J.-Y.; Kang S.-W., Smart Electronics and MEMS, v.3242, pp.202 - 211, 1997-12-11 |
| Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Chae, Jung-Hun; Lee, Jae-Youl; Kang, Sang-Won, SPIE Vol. 3242, pp.202-211, 1997 |
| Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Chae, JH; Lee, JY; Kang, Sang-Won, SENSORS AND ACTUATORS A-PHYSICAL, v.75, no.3, pp.222 - 229, 1999-06 |
| Measurement of thermal properties of liquid analytes using microfluidic resonators via photothermal modulation Abraham, Rosmi; Yoon, Yeowon; Khan, Faheem; Bukhari, Syed A.; Kim, Chun-il; Thundat, Thomas; Chung, Hyun-Joong; et al, SENSORS AND ACTUATORS A-PHYSICAL, v.347, 2022-11 |
| Measurement of thermo-optic coefficients in sol-gel hybrid glass films Kang, ES; Bae, JY; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.26, no.1-3, pp.981 - 984, 2003-01 |
| Measurement of thermodynamic properties and cycle analysis of new working fluids used in air-cooled absorption heat pump = 공냉형 흡수식 냉방기에 사용되는 신용액의 물성 측정 및 분석link Park, Young; 박영; et al, 한국과학기술원, 1997 |
| Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, SEM'04, 2004 |
| Measurement of Thermomechanical Behavior of Solder Joints under Power cycling Condition Using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition Ham, Suk-Jin; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.323 - 327, 2001 |
| Measurement of thin film adhesion by single cantilever beam method equipped with adjustable jig Shin, Dong-Kil; Lee, Jung-Ju; Hawong, Jai-Sug, International Conference on Experimental Mechanics 2014, ICEM 2014, SPIE, 2014-11 |
| Measurement of Three-Dimensional Rotational and Translational Displacements using a Multi-Facet Mirror Park W.S.; Cho, Hyungsuck, Optomechatronic Systems IV, v.5264, pp.84 - 95, International Society for Optical Engineering (SPIE), 2003-10-28 |
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