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Showing results 113181 to 113200 of 275992
| Interfacial Engineering of Confined Metal-Hydrogen Nanostructure for Mass and Heat Transfer in Solid-State Hydrogen Storage Cho, Eun Seon, The 17th International Symposium on Metal-Hydrogen Systems, Metal-Hydrogen Systems, 2022-10-31 |
| Interfacial engineering to enhance ordering and orientation of block copolymer thin film by surfactant design = 계면활성제 설계를 통한 규칙성 및 배향이 향상된 블록공중합체 박막에 대한 연구link Youn, Min Young; Kim, Bumjoon; et al, 한국과학기술원, 2021 |
| Interfacial enhancement between lithium electrode and polymer electrolytes Choi, NS; Lee, YM; Park, JH; Park, Jung-Ki, Selected Papers Presented at the 11th IMLB, pp.610 - 616, 2002-06-22 |
| Interfacial enhancement between lithium electrode and polymer electrolytes Choi, Nam-Soon; Lee, YM; Park, JH; Park, Jung-Ki, JOURNAL OF POWER SOURCES, v.119, pp.610 - 616, 2003-06 |
| Interfacial Force between Cyclopentane Hydrate Probe and NaCl-Containing Solutions Lee, Won-Hee; Baek, Seungjung; Kim, Jong-Duk; Lee, Jae Woo, 8th International Conference on Gas Hydrates, Chaina Geological Survey, Chanese Academy of Sciences, 2014-07-31 |
| Interfacial fracture analysis of adhesive-bonded joints Kim W.-S.; Lee, Jungju, ADVANCED MATERIALS RESEARCH, v.33-37, no.0, pp.327 - 332, 2008 |
| Interfacial fracture energy measurements in the Cu/Cr/polyimide system Park, YB; Park, IS; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.261 - 266, 1999-06 |
| Interfacial Heat Transfer Coefficient Between Casting and Mold Zin-Hyoung Lee, International Conference on High-New Technology and traditional Industry, 1996 |
| Interfacial Instability-Driven Morphological Transition of Prolate Block Copolymer Particles: Striped Football, Larva to Sphere Lee, Seonghan; Shin, Jaeman J.; Ku, Kang Hee; Lee, Young Jun; Jang, Se Gyu; Yun, Hongseok; Kim, Bumjoon J., MACROMOLECULES, v.53, no.16, pp.7198 - 7206, 2020-08 |
| Interfacial Interaction Engineering of FeCoS@CoMoP for pH-Universal H<sub>2</sub> and Alkaline Medium O<sub>2</sub> Evolution Jiao, Danhua; Lu, Wenjuan; Song, Qun; Cai, Xiaodong; Xu, Liangliang; Wang, Qizhao; Du, Haijun, ACS APPLIED NANO MATERIALS, v.6, no.23, pp.21922 - 21933, 2023-11 |
| Interfacial Interactions of Single-Walled Carbon Nanotube/Conjugated Block Copolymer Hybrids for Flexible Transparent Conductive Films Park, Ho-Seok; Choi, Bong-Gill; Hong, Won-Hi; Jang, Sung-Yeon, JOURNAL OF PHYSICAL CHEMISTRY C, v.116, no.14, pp.7962 - 7967, 2012-04 |
| Interfacial Layer Control by Dry Cleaning Technology for Polycrystalline and Single Crystalline Silicon Growth Im, Dong-Hyun; Lee, Kong-Soo; Kang, Yoongoo; Jeong, Myoungho; Park, Kwang Wuk; Lee, Soon-Gun; Ma, Jin-Won; et al, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.16, no.5, pp.4906 - 4913, 2016-05 |
| INTERFACIAL LAYER FORMATION OF THE CDTE/INSB HETEROINTERFACES GROWN BY TEMPERATURE-GRADIENT VAPOR TRANSPORT DEPOSITION KIM, TW; PARK, HL; Lee, JeongYong; LEE, HJ, APPLIED PHYSICS LETTERS, v.65, no.20, pp.2597 - 2599, 1994-11 |
| INTERFACIAL LAYER FORMATION ON CORRUGATED INP DURING THE EPITAXIAL-GROWTH OF GAINASP/INP DISTRIBUTED-FEEDBACK LASER-DIODE STRUCTURE Jang, DH; Kim, JS; Park, KH; Lee, JK; Cho, HS; Nahm, S; Lee, SW; et al, JOURNAL OF CRYSTAL GROWTH, v.156, no.4, pp.368 - 372, 1995-12 |
| Interfacial layer properties of HfO2 films formed by plasma-enhanced atomic layer deposition on silicon Park, PK; Roh, JS; Choi, BH; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.5, pp.F34 - F37, 2006-03 |
| Interfacial Light Scattering Study in Microemulsion Kim, Mahn-Won, Proceedings of the society of Petroleum Engineering-DOE Third Joint Symposium on Enhanced Oil recovery, pp.0 - 0, 1982-06 |
| Interfacial microrheology of DPPC monolayers at the air-water interface Kim, KyuHan; Choi, Siyoung Q.; Zasadzinski, Joseph A.; Squires, Todd M., SOFT MATTER, v.7, no.17, pp.7782 - 7789, 2011-09 |
| Interfacial microstructure and bonding strength of ceramic/metal joined with brazing 최시경; Park, SY, 대한 용접 학회, pp.129 -, 1991 |
| Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01 |
| Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04 |
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