Browse by Title
Showing results 112961 to 112980 of 275771
| Interdependent safety assessment of integrated low-and intermediate radioactive waste disposal system in the Republic of Korea 한솔찬; 조영흠; 이준엽; 윤종일, 2015 Korean Radioactive Waste Society Spring Meeting, 한국방사성폐기물학회, 2015-05-29 |
| Interdependent selves show face-induced facilitation of error processing: cultural neuroscience of self-threat Park, Jiyoung; Kitayama, Shinobu, SOCIAL COGNITIVE AND AFFECTIVE NEUROSCIENCE, v.9, no.2, pp.201 - 208, 2014-02 |
| Interdiffused thermoplastic urethane-PEDOT:PSS bilayers with superior adhesion properties for high-performance and intrinsically-stretchable organic solar cells Lee, Jinho; Lee, Jin-Woo; Song, Hyunggwi; Song, Myoung; Park, Jinseok; Kim, Geon-U; Jeong, Dahyun; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.11, no.24, pp.12846 - 12855, 2023-06 |
| INTERDIFFUSION AND WAVELENGTH MODIFICATION IN IN0.53GA0.47AS/IN0.52AL0.48AS QUANTUM-WELLS BY LAMP ANNEALING SEO, KS; BHATTACHARYA, PK; KOTHIYAL, GP; Hong, Songcheol, APPLIED PHYSICS LETTERS, v.49, no.15, pp.966 - 968, 1986-10 |
| Interdiffusion in antiferromagnetic/ferromagnetic exchange coupled NiFe/IrMn/CoFe multilayer Lee, JH; Jeong, HD; Yoon, CS; Kim, CK; Park, Byong Guk; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.91, no.3, pp.1431 - 1435, 2002-02 |
| Interdiffusion Reaction Layer Growth Behavior of U-Mo/Al Dispersion Fuels 류호진, 한국원자력학회 춘계학술대회, 한국원자력학회, 2003-05 |
| Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
| Interdigitated Electrodes System for Freestanding Sliding Mode of Triboelectric Energy Harvesting 김지석; 김종남; 오일권, 한국복합재료학회 춘계학술대회, 한국복합재료학회, 2020-08-18 |
| Interdigitated Three-Dimensional Heterogeneous Nanocomposites for High-Performance Mechanochromic Smart Membranes Chen, Haomin; Cho, Donghwi; Ko, Kwonhwan; Qin, Caiyan; Kim, Minsoo. P; Zhang, Heng; Lee, Jeng-Hun; et al, ACS NANO, v.16, no.1, pp.68 - 77, 2022-01 |
| Interdimensional universality of dynamic interfaces Kim, Kab-Jin; Lee, Jae-Chul; Ahn, Sung-Min; Lee, Kang-Soo; Lee, Chang-Won; Cho, Young Jin; Seo, Sunae; et al, NATURE, v.458, no.7239, pp.740 - 742, 2009-04 |
| Interdisciplinary Approach to Science (IAS) Program in Institute for Gifted Students of KAIST Bae, Saebyok, KAIST 과학영재교육연구원, 한국과학기술한림원(KAST), pp.50 - 60, 2005-12-01 |
| Interest rate clustering: empirical evidence = 금리의 군집효과에 대한 실증 분석link Lee, Jae-Hoon; 이재훈; et al, 한국과학기술원, 2007 |
| Interest Rate Parity and Currency Option Price J. Ha; B. Rhee; Hyun, Jung-Soon, JOURNAL OF INTERNATIONAL FINANCE AND ECONOMICS, v.8, no.4, 2008-11 |
| Interest rates factor model Lee, Sang-Wook; Kim, Min-Jae; Kim, Soo-Yong, PHYSICA A-STATISTICAL MECHANICS AND ITS APPLICATIONS, v.390, no.13, pp.2531 - 2548, 2011-07 |
| Interest Sustainability-Aware Recommender System Hyun, Dongmin; Cho, Junsu; Park, Chanyoung; Yu, Hwanjo, 20th IEEE International Conference on Data Mining, ICDM 2020, pp.192 - 201, IEEE, 2020-11-17 |
| Interesterification between Triolein and Stearic Acid by Immobilized Lipase Rhee, Joon Shick, Ibid, pp.93 - 93, 1990 |
| Interesting Characteristics of Two-Step SiC:H Film and Its Application to a-Si:H Solar Cells Lim, Koeng Su, , 2000-01-01 |
Interesting phase behaviors and ion-conducting properties of dicationic N-alkylimidazolium tetrafluoroborate salts Chae, Hyunho; Lee, Yong-Hoon; Yang, Minyong; Yoon, Won-Jin; Yoon, Dong Ki; Jeong, Kwang-Un; Song, Yeon Hwa; et al, RSC ADVANCES, v.9, no.7, pp.3972 - 3978, 2019-01 |
| Interests, Ideas, and Information: A Multilevel Analysis of the Nonresponse Problem in the Globalization Surveys Kim, So Young, Annual Meeting of American Political Science Association, American Political Science Association, 2006-09-01 |
| Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Sun, Rong; Paik, Kyung-Wook, 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08 |
Discover
Type
Open Access
Date issued
- 30,970 2020 - 2024
- 100,006 2010 - 2019
- 75,681 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969