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Showing results 82961 to 82980 of 100273
| Thermophotonic cells in self-sustaining parallel circuits Yang, Zhimin; Song, Jaeman; Lee, Bong Jae, JOURNAL OF QUANTITATIVE SPECTROSCOPY & RADIATIVE TRANSFER, v.312, 2024-01 |
| Thermophotovoltaic Energy Conversion in Far-to-Near-Field Transition Regime Song, Jaeman; Jang, Junho; Lim, Mikyung; Choi, Minwoo; Lee, Jungchul; Lee, Bong Jae, ACS PHOTONICS, v.9, no.5, pp.1748 - 1756, 2022-05 |
| Thermopiezoelastic nonlinear dynamics of active piezolaminated plates Oh, Il-Kwon, SMART MATERIALS & STRUCTURES, v.14, no.4, pp.823 - 834, 2005-08 |
| Thermopiezoelastic snapping of piezolaminated plates using layerwise nonlinear finite elements Oh, Il-Kwon; Han, Jae-Hung; Lee, In, AIAA JOURNAL, v.39, no.6, pp.1188 - 1197, 2001-06 |
Thermoplasmonic neural chip platform for in situ manipulation of neuronal connections in vitro Hong, Nari; Nam, Yoonkey, NATURE COMMUNICATIONS, v.11, no.1, pp.6313, 2020-12 |
| Thermoplasmonic Optical Fiber for Localized Neural Stimulation Kang, Hongki; Hong, Woongki; An, Yujin; Yoo, Sang Jin; Kwon, Hyuk-Jun; Nam, Yoonkey, ACS NANO, v.14, no.9, pp.11406 - 11419, 2020-09 |
| Thermoplasmonic Scaffold Design for the Modulation of Neural Activity in Three-Dimensional Neuronal Cultures Andolfi, Andrea; Jang, Hyunsoo; Martinoia, Sergio; Nam, Yoonkey, BIOCHIP JOURNAL, v.16, no.4, pp.451 - 462, 2022-09 |
| Thermopower detection of single nanowire using a MEMS device Shin, Ho Sun; Lee, Joon Sung; Jeon, Seong Gi; Yu, Jin; Song, Jae Yong, MEASUREMENT, v.51, pp.470 - 475, 2014-05 |
| Thermoresponsive hydrogel photonic crystals by three-dimensional holographic lithography Kang, Ji-Hwan; Moon, Jun Hyuk; Lee, Seung-Kon; Park, Sung-Gyu; Jang, Se Gyu; Yang, Shu; Yang, Seung-Man, ADVANCED MATERIALS, v.20, no.16, pp.3061 - 3065, 2008-08 |
| Thermoresponsive Microcarriers for Smart Release of Hydrate Inhibitors under Shear Flow Lee, Sang Seok; Park, Juwoon; Seo, Yutaek; Kim, Shin-Hyun, ACS APPLIED MATERIALS & INTERFACES, v.9, no.20, pp.17179 - 17186, 2017-05 |
| Thermoreversible gelation and self-assembly behavior of dibenzylidene sorbitol in ternary solvent mixtures John, Jerin; Ardhianto, Kurniawan; Nandagopalan, Purushothaman; Baek, Seung Wook, COLLOID AND POLYMER SCIENCE, v.297, no.4, pp.493 - 502, 2019-04 |
| Thermosensitive permeation from side-chain crystalline ionomers Lee, JW; Park, Jung-Ki; Lee, KH, JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, v.38, no.6, pp.823 - 830, 2000-03 |
| Thermosensitive pluronic micelles stabilized by shell cross-linking with gold nanoparticles Bae, Ki-Hyun; Choi, Seung-Ho; Park, Sung-Young; Lee, Yu-Han; Park, Tae-Gwan, LANGMUIR, v.22, no.14, pp.6380 - 6384, 2006-07 |
| Thermosensitive sol-gel transition behaviors of poly(ethylene oxide)/aliphatic polyester/poly (ethylene oxide) aqueous solutions Song, MJ; Lee, DS; Ahn, JH; Kim, DJ; Kim, Sung Chul, JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY, v.42, no.3, pp.772 - 784, 2004-02 |
| Thermosensitive, Stretchable, and Piezoelectric Substrate for Generation of Myogenic Cell Sheet Fragments from Human Mesenchymal Stem Cells for Skeletal Muscle Regeneration Yoon, Jeong-Kee; Misra, Mirnmoy; Yu, Seung Jung; Kim, Han Young; Bhang, Suk Ho; Song, Seuk Young; Lee, Ju-Ro; et al, ADVANCED FUNCTIONAL MATERIALS, v.27, no.48, 2017-12 |
| Thermoset elastomers covalently crosslinked by hard nanodomains of triblock copolymers derived from carvomenthide and lactide: tunable strength and hydrolytic degradability Jang, Jeongmin; Park, Hyejin; Jeong, Haemin; Mo, Eunbi; Kim, Yongbin; Yuk, Jeong Suk; Choi, Siyoung Q.; et al, POLYMER CHEMISTRY, v.10, no.10, pp.1245 - 1257, 2019-03 |
| Thermoset Elastomers Derived from Carvomenthide Yang, Jinyoung; Lee, Sangjun; Choi, Woo Jin; Seo, Howon; Kim, Pilhan; Kim, Geon-Joong; Kim, Young-Wun; et al, BIOMACROMOLECULES, v.16, no.1, pp.246 - 256, 2015-01 |
| Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
| Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
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