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Hlineny, Petr; Kwon, O-Joung; Obdrzalek, Jan; Ordyniak, Sebastian, EUROPEAN JOURNAL OF COMBINATORICS, v.56, pp.46 - 56, 2016-08

Lee, Juho; Choi, Seungjin, Advances in Neural Information Processing Systems (NIPS 2015), Neural Information Processing Systems Foundation, 2015-12-10

Binkley, Dave; Gold, Nicolas; Islam, Syed; Krinke, Jens; Yoo, Shin, Source Code Analysis and Manipulation (SCAM), IEEE COMPUTER SOC, 2017-09-17

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Han, Sang Gyu; Myaeng, Sung Hyon; et al, 한국과학기술원, 2017

Han, Sanggyu; Myaeng, Sung-Hyon, 16th IEEE International Conference on Machine Learning and Applications (ICMLA), pp.971 - 976, IEEE, 2017-12-20

CHUN, KW; Ra, Jong Beom, ELECTRONICS LETTERS, v.30, no.20, pp.1662 - 1664, 1994-09

Han, Jong-Ki; Kim, Hyung-Myung, SPIE Conference on Still-Imagae Compression, v.2418, no.0, pp.142 - 153, 1995-02-07

Rios-Berrios, Miguel; Sharma, Puneet; Lee, Tak Yeon; Schwartz, Rachel; Shneiderman, Ben, GOVERNMENT INFORMATION QUARTERLY, v.29, no.2, pp.212 - 222, 2012-04

Bui, Van-Tien; Zhou, Qitao; Kim, Jong-Nam; Oh, Jung-Hwan; Han, Kwan-Woo; Choi, Ho-Suk; Kim, Sang-Woo; et al, ADVANCED FUNCTIONAL MATERIALS, v.29, no.28, 2019-07

Liu, R; Barkhordarian, H; Emadi, S; Park, Chan Beum; Sierks, MR, NEUROBIOLOGY OF DISEASE, v.20, no.1, pp.74 - 81, 2005-10

Kim, Kwang-Soon; 김광순; et al, 한국과학기술원, 1999

Kim, HC; Kim, B, AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, v.58, no.4, pp.302 - 304, 2004

Park, Hyuncheol; Barry, John R., IEEE Global Telecommunications Conference (Globecom 1998), IEEE, 1998-11-08

Park, Hyuncheol; Barry, John R., IEEE TRANSACTIONS ON COMMUNICATIONS, v.52, no.4, pp.643 - 651, 2004-04

Lee, SS; Jwa, JW; Lee, Hwang Soo, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E80B, no.4, pp.632 - 638, 1997-04

Choi, Junil; Love, David J.; Kim, Taeyoung, IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, v.14, no.4, pp.2007 - 2016, 2015-04

Song, Kyeong Min; Jung, Yeon Sik, International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2018), The Korean Institute of Metals and Materials, 2018-11-12

Kim, Do Hyung; Lee, Kwang-Heum; Lee, Seung Hee; Kim, Junsung; Yang, Junghoon; Kim, Jingyu; Cho, Seong-In; et al, IEEE ELECTRON DEVICE LETTERS, v.43, no.10, pp.1677 - 1680, 2022-10