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Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal Sohn, WH; Bong, HH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.355, pp.231 - 240, 2003-08 |
알루미늄과 이종소재의 접합공정 및 접합기구 = Joining process and bonding mechanism between aluminum and dissimilar metalslink 손웅희; Sohn, Woong-Hee; et al, 한국과학기술원, 2003 |
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