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| Stress intensities at the triple junction of a multilevel thin film package Jeon, Insu; Kang, Ki-Ju; Im, Seyoung, MICROELECTRONICS RELIABILITY, v.48, no.5, pp.749 - 756, 2008-05 |
| Stress intensity factors and crack initiation directions for ceramic/metal joint Kim, JH; Lee, Soon-Bok, THEORETICAL AND APPLIED FRACTURE MECHANICS, v.30, no.1, pp.27 - 38, 1998-09 |
| Stress intensity factors and kink angle of a crack interacting with a circular inclusion under remote mechanical and thermal loadings Lee, Saebom; Choi, Seung Tae; Earmme, Youn Young; Chung, Dae Youl, KSME International Journal, v.17, no.8, pp.1120 - 1132, 2003-08 |
| Stress Intensity Factors for Cracked Adhesively Bonded Orthotropic Plates h.s. ro; Hong, Chang Sun, INTERNATIONAL JOURNAL OF FRACTURE, v.17, no.6, pp.181 - 184, 1981 |
| STRESS INTENSITY FACTORS IN ANISOTROPIC SANDWICH PLATE WITH A PART-THROUGH CRACK UNDER MIXED-MODE DEFORMATION Hong, Chang Sun; JEONG, KY, ENGINEERING FRACTURE MECHANICS, v.21, no.2, pp.285 - 292, 1985 |
| Stress Intensity Factors in Finite Orthotropic Plates with a Crack Under Mixed Mode Deformation Yum, Y. J.; Hong, Chang Sun, INTERNATIONAL JOURNAL OF FRACTURE, v.47, no.1, pp.53 - 67, 1991-01 |
| Stress intensity factors of an oblique edge crack subjected to normal and shear tractions Kim, HK; Lee, Soon-Bok, THEORETICAL AND APPLIED FRACTURE MECHANICS, v.25, no.2, pp.147 - 154, 1996 |
| Stress relaxation in thick-film GaN grown by hydride vapor phase epitaxy on sapphire and spinel substrates as studied by photoluminescence and Raman spectroscopy Park, Hae Yong; Kim, Jae Eun, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.34, no.2, pp.163 - 167, 1999-02 |
| Stress scenario selection by empirical likelihood Glasserman, Paul; Kang, Chulmin; Kang, Wan-Mo, QUANTITATIVE FINANCE, v.15, no.1, pp.25 - 41, 2015-01 |
| Stress Wave Emission and Plastic Work of Notched Specimen K. Ishikawa; Kim, Ho Chul, JOURNAL OF MATERIALS SCIENCE, v.9, no.5, pp.737 - 743, 1974 |
| Stress, coping and consumer preferences: a two-way transitional event history analysis Lee, EueHun; Moschis; Mathur, INTERNATIONAL JOURNAL OF CONSUMER STUDIES, v.31, no.4, pp.428 - 435, 2007-03 |
| Stress- and temperature-dependent hysteresis of the shear modulus of solid helium Kang, Evan S. H.; Kim, Duk Young; Kim, Hyoung Chan; Kim, Eunseong, PHYSICAL REVIEW B, v.87, no.9, pp.094512, 2013-03 |
| Stress-associated neurobiological activity is linked with acute plaque instability via enhanced macrophage activity: a prospective serial 18F-FDG-PET/CT imaging assessment Kang, Dong Oh; Eo, Jae Seon; Park, Eun Jin; Nam, Hyeong Soo; Song, Joon Woo; Park, Ye Hee; Park, So Yeon; et al, EUROPEAN HEART JOURNAL, v.42, no.19, pp.1883 - 1895, 2021-05 |
| Stress-based finite element analysis of plane plasticity problems Wieckowski, Z; Youn, Sung-Kie; Moon, BS, INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, v.44, no.10, pp.1505 - 1525, 1999-04 |
| Stress-based springback reduction of a channel shaped auto-body part with high-strength steel using response surface methodology Song, Jung-Han; Huh, Hoon; Kim, Se-Ho, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.129, no.3, pp.397 - 406, 2007-07 |
| Stress-Corrosion Cracking Behaviour of Zircaloy-4 in Aqueous Solution m.-h.hong; Pyun, Su Il; s.-u.chung; j.-s.kim, JOURNAL OF NUCLEAR MATERIALS, v.173, pp.7 - 13, 1990 |
| STRESS-CORROSION CRACKING INITIATION IN FERRITIC STAINLESS-STEELS IN A CHLORIDE ENVIRONMENT LOCCI, IE; Kwon, Hyuk-Sang; HEHEMANN, RF; TROIANO, AR, CORROSION, v.43, no.8, pp.465 - 470, 1987-08 |
| Stress-engineered palladium nanowires for wide range (0.1%-3.9%) of H-2 detection with high durability Lee, Jae Shin; Seo, Min-Ho; Choi, Kwang-Wook; Yoo, Jae-Young; Jo, Minseung; Yoon, Jun-Bo, NANOSCALE, v.11, no.35, pp.16317 - 16326, 2019-09 |
| Stress-induced alterations in hippocampal plasticity, place cells, and spatial memory Kim, JJ; Lee, HJ; Welday, AC; Song, E; Cho, J; Sharp, PE; Jung, MW; et al, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.104, pp.18297 - 18302, 2007-11 |
| Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride Lee, Seok-Hee; Bravman, JC; Doan, JC; Lee, S; Flinn, PA; Marieb, TN, JOURNAL OF APPLIED PHYSICS, v.91, no.6, pp.3653 - 3657, 2002-03 |
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