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Showing results 72541 to 72560 of 100432

72541
Signal Encoder of Real-Time Bio-Aerosol Counter Using 280 nm UV-LED Induced Fluorescence

Park, Jinho; Jeong, Young-Su; Nam, Hyunwoo; Choi, Kibong, IEEE SENSORS JOURNAL, v.20, no.22, pp.13471 - 13479, 2020-11

72542
Signal flow control of complex signaling networks

Lee, Daewon; Cho, Kwang-Hyun, SCIENTIFIC REPORTS, v.9, 2019-10

72543
Signal Generation due to Alpha Particle in Hydrogenated Amorphous Silicon Radiation Detectors

Kim, HoKyung; Cho, Gyu-Seong, NUCLEAR ENGINEERING AND TECHNOLOGY , v.28, no.4, pp.397 - 404, 1996-06

72544
SIGNAL GENERATION IN A HYDROGENATED AMORPHOUS-SILICON DETECTOR

QURESHI, S; PEREZMENDEZ, V; KAPLAN, SN; FUJIEDA, I; Cho, Gyuseong; STREET, RA, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.36, no.1, pp.194 - 198, 1989-02

72545
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

72546
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

72547
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11

72548
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

72549
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01

72550
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09

72551
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

Shin, Taein; Park, Shinyoung; Kim, Seongguk; Kim, Subin; Son, Kyungjune; Park, Hyunwook; Lho, Daehwan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07

72552
The Signal Outside Directors Send to Foreign Investors

Rhee, Mooweon; Lee, Ji-Hwan, KAIST Business School Working Paper Series KBS-WP-2007-002, 2007-04

72553
Signal Power-Insensitive Analog MEMS Tunable Capacitor by Immobilizing the Movable Plates

Yang, Hyun-Ho; Han, Chang-Hoon; Choi, Seon-Jin; Choi, Dong-Hoon; Yoon, Jun-Bo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.24, no.5, pp.1545 - 1556, 2015-10

72554
Signal Processing Advances for 3G WCDMA: From Rake Receivers to Blind Techniques

Sung, Youngchul; Lim, Yirang; Tong, Lang; van der Veen, Alle-Jan, IEEE COMMUNICATIONS MAGAZINE, v.47, no.1, pp.48 - 54, 2009-01

72555
Signal processing algorithm for transmission-type Fabry-Perot interferometric optical fiber sensor

Kim, SH; Lee, Jungju; Kwon, Dong-Soo, SMART MATERIALS STRUCTURES, v.10, no.4, pp.736 - 742, 2001-08

72556
Signal ratio amplification via modulation of resonance energy transfer: Proof of principle in an emission ratiometric Hg(II) sensor

Coskun, Ali; Akkaya, Engin U., JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.128, no.45, pp.14474 - 14475, 2006-11

72557
SIGNAL READOUT IN A-SIH PIXEL DETECTORS

Cho, Gyuseong; DREWERY, JS; HONG, WS; JING, T; KAPLAN, SN; LEE, H; PEREZMENDEZ, V; et al, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.40, no.4, pp.323 - 327, 1993-08

72558
Signal self-enhancement by coordinated assembly of gold nanoparticles enables accurate one-step-immunoassays

Kwon, J-H.; Kim, H-T.; Lee, J-H.; Kim, Reehyang; Heo, Minsung; Shin, Jonghwa; Lee, H-Y.; et al, NANOSCALE, v.9, no.42, pp.16476 - 16484, 2017-11

72559
Signal space detection for DVD optical recording

Steingrimsson, B; Moon, Jaekyun; Oenning, T, IEEE TRANSACTIONS ON MAGNETICS, v.37, no.2, pp.670 - 675, 2001-03

72560
Signal space detection for recording channels with jitter noise

Kim, Y; Moon, Jaekyun, IEEE TRANSACTIONS ON INFORMATION THEORY, v.47, no.3, pp.1153 - 1165, 2001-03

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