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Showing results 213181 to 213200 of 276410

213181
Wet Pretreatment-Induced Modification of Cu(In,Ga)Se-2/Cd-Free ZnTiO Buffer Interface

Hwang, Suhwan; Liudmila, Larina; Lee, Hojin; Kim, Suncheul; Choi, Kyoung Soon; Jeon, Cheolho; Ahn, Byung Tae; et al, ACS APPLIED MATERIALS & INTERFACES, v.10, no.24, pp.20920 - 20928, 2018-06

213182
Wet-Chemical Digital Etching of Nanogratings for Realization of Size Controlled Nanowires

Jo, Minseung; Seo, Min-Ho; Choi, Kwang-Wook; Yoon, Jun-Bo, NANO KOREA 2017 Symposium, Ministry of Science and ICT, Ministry of Trade, Industry & Energy, 2017-07-12

213183
Wet-to-Dry Hybrid Spinning of Graphene Fiber Inspired by Spider Silk Production Mechanisms

Lee, Kyueui; Do, Min Jae; Seo, Young Chang; Lee, Haeshin, ADVANCED MATERIALS INTERFACES, v.5, no.21, 2018-11

213184
WetA bridges cellular and chemical development in Aspergillus flavus

Wu, Ming-Yueh; Mead, Matthew E.; Kim, Sun-Chang; Rokas, Antonis; Yu, Jae-Hyuk, PLOS ONE, v.12, no.6, 2017-06

213185
Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic

Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10

213186
Wettability and Interfacial Reactions of Sn-based Pb-free Solders with Cu-xZn Alloy UBMs

Lee, Hyuck Mo, Korean Journal of Metal and Materials, 2008-04-24

213187
Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies

Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04

213188
Wettability Control Using by Wrinkled Dielectric Elastomer Actuator

Jun, Ki Woo; Oh, Il Kwon, ACCM-10: The 10th Asian-Australasian Conference on Composite Materials, The Korean Society for Composite Materials, 2016-10-17

213189
Wettability Effect on CHF in Subcooled Boiling Region using Cu-coated Surfaces under Flow and Atmospheric Pressure Conditions

KAM, DONG HOON; Choi, Young Jae; Jeong, Yong Hoon, Korean Nuclear Society Spring Meeting, Korean Nuclear Society, 2017-05-19

213190
Wettability of heated surfaces under pool boiling using surfactant solutions and nano-fluids

Jeong, Yong Hoon; Chang, Won Joon; Chang, Soon-Heung, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.51, no.11-12, pp.3025 - 3031, 2008-06

213191
Wettability of Heated Surfaces under Pool Boiling using Surfactant Solutions and Nanofluids

Chang, Won Joon; Jeong, Yong Hoon; Chang, Soon-Heung, Korean Nuclear Society Spring Meeting, Korean Nuclear Society, 2007-05-11

213192
Wettability of Rough Surface with Hierarchical Structure Fabricated by Electron Irradiation of Polymers

Cho, Sung Oh; Lee, Eun Je, International Workshop on Accelerator and Beam Utilization, pp.BU-58 - BU-58, 2006

213193
Wettability-Based Cell Sorting: Exploring Label-Free Isolation Strategy for Mixed Primary Glial Cell Population

Park, Eunyoung; Lee, Minseok; Poon, Mong Lung Steve; Lee, Eunjung; Im, Sung Gap; Shin, Jennifer H., ADVANCED MATERIALS INTERFACES, v.9, no.22, 2022-08

213194
Wetted area of packing materiels in a packed column = 충전밥 내에서의 충전물의 젖는 면적에 관하여link

Ju, Dong-Pyo; 주동표; et al, 한국과학기술원, 1975

213195
Wetting behavior and nanotribological properties of silicon nanopatterns combined with diamond-like carbon and perfluoropolyether films

Pham, D. C.; Na, K.; Piao, S.; Cho, I-J; Jhang, K-Y; Yoon, E-S, NANOTECHNOLOGY, v.22, no.39, 2011-09

213196
Wetting of the coated surface: Superhydrophobic surface and SLIPS

Kim, Do Hyun, International Conference on Industrial Chemistry, Conference Series LLC, 2016-06-28

213197
Wetting Phenomena Between Sealing Glass and Free Cutting Steel

H. Kim; C.H. Kim, 한국요업학회지, v.19, no.1, pp.24 - 34, 1982

213198
Wetting Properties and Interfacial Reaction of Cu5Zn8-Bearing Pb-Free Solder on the Cu substrate by Mecanical Alloying

Lee, Hyuck Mo, 2009 TMS annual meeting (138th), 2009-03-17

213199
Wetting properties and interfacial reactions of Cu5Zn8-bearing Pb-free solders on the Cu substrate by MA

Lee, Hyuck Mo, Korean Journal of Metal and Materials, 2009-04-23

213200
Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate

Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11

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