| 10 | Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
| 11 | Design and demonstration of optical-PCB-based optical serial bus for high-speed computer interfaces = 고속 컴퓨터 인터페이스를 위한 광 PCB 기반 광 직렬 버스 설계 및 구현link Im, Dong-Min; 임동민; et al, 한국과학기술원, 2011 |
| 12 | Design and demonstration of optical-PCB-based optical serial bus for high-speed computer interfaces = 고속 컴퓨터 인터페이스를 위한 광 PCB 기반 광 직렬 버스 설계 및 구현link Im, Dong-Min; 임동민; et al, 한국과학기술원, 2011 |
| 13 | Design and implementation of pluggable optical backplane system with flexible polymeric waveguide. = 플렉서블 고분자 광도파로를 이용한 광백플레인 시스템의 설계 및 구현에 관한 연구link Ahn, Seung-Ho; 안승호; et al, 한국과학기술원, 2010 |
| 14 | Design of bidirectional CMOS transceiver and its application for optical interconnection on optical PCB = 양방향 CMOS 광트랜시버 설계 및 광 PCB상에서의 광연결을 위한 그의 응용에 관한 연구link Kang, Sae-Kyoung; 강세경; et al, 한국정보통신대학교, 2006 |
| 15 | Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications Cho, HS; Kang, S; Rho, BS; Park, HyoHoon; Shin, KU; Ha, SW; Rhee, BH; et al, OPTICAL ENGINEERING, v.43, no.12, pp.3083 - 3088, 2004-12 |
| 16 | High-coupling-efficiency optical interconnection using a 90(circle)-bent fiber array connector in optical printed circuit boards Cho, MH; Hwang, SH; Cho, HS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, no.3, pp.690 - 692, 2005-03 |
| 17 | Multigigabit CMOS limiting amplifier and VCSEL driver arrays for parallel optical interconnects Kang, SK; Lee, TW; Park, HyoHoon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, no.8, pp.1656 - 1659, 2006-08 |
| 18 | Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
| 19 | Passively assembled optical inter-connection system based on an optical printed-circuit board Hwang, SH; Cho, MH; Kang, SK; Park, HyoHoon; Cho, HS; Kim, SH; Shin, KU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.5-8, pp.652 - 654, 2006-03 |
| 20 | PCB-compatible optical interconnection using 45 degrees-ended connection rods and via-holed waveguides Rho, BS; Kang, S; Cho, HS; Park, HyoHoon; Ha, SW; Rhee, BH, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.22, no.9, pp.2128 - 2134, 2004-09 |
| 21 | Performance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects Ukaegbu, Ikechi Augustine; Kim, Do-Won; Shirazy, Mohammed Shorab Muslim; Lee, Tae-Woo; Cho, Mu-Hee; Park, Hyo-Hoon, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.5, pp.740 - 748, 2013-05 |
| 22 | VCSEL array module using (111) facet mirrors of a v-gooved silicon optical bench and angled fibers Hwang, SH; An, JY; Kim, MH; Choi, WC; Cho, SR; Lee, SH; Cho, HS; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, no.2, pp.477 - 479, 2005-02 |
| 23 | 광 연결용 다중모드 광도파로 소자의 제작 = Fabrication of multimode waveguide devices for optical interconnectionlink 김상균; Kim, Sang-Gyun; et al, 한국과학기술원, 2001 |
| 24 | 광 연결용 다중모드 광도파로와 45도 경사 거울의 제작 = Multimode waveguide with a 45 degree mirror for optical interconnectionlink 이종환; Lee, Jong-Hwan; et al, 한국과학기술원, 2002 |
| 25 | 인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumpslink 주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2003 |
| 26 | 자유공간 광연결을 위한 송수신회로의 소비전력 최소화 = Minimizatuin of power consumption in transceiver circuit design for free-space optical interconnectionlink 이태구; Lee, Tae-Goo; et al, 한국정보통신대학원대학교, 2000 |
