Researcher Page

사진

Yu, Jin (유진) C-1855-2011

Department
Department of Materials Science & Engineering(신소재공학과)
Website
http://epl.kaist.ac.krHomePage
Research Area
Electronic Packaging Materials, Mech. of Mat., Creep, Fracture

Keyword Cloud

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1

Precisely Geometry Controlled Microsupercapacitors for Ultrahigh Areal Capacitance, Volumetric Capacitance, and Energy Density

Yoo, Jungjoon; Byun, Segi; Lee, Chan-Woo; et al, CHEMISTRY OF MATERIALS, v.30, no.12, pp.3979 - 3990, 2018-06

2

Metal sputtered graphene based hybrid films comprising tin oxide/reduced graphene oxide/Ni as electrodes for high-voltage electrochemical capacitors

Byun, Segi; Shin, Byungharesearcher; Yu, Jinresearcher, CARBON, v.129C, pp.1 - 7, 2018-04

3

Direct formation of a current collector layer on a partially reduced graphite oxide film using sputter-assisted metal deposition to fabricate high-power micro-supercapacitor electrodes

Byun, Segi; Yu, Jinresearcher, JOURNAL OF POWER SOURCES, v.307, pp.849 - 855, 2016-03

4

Effects of doping and planar defects on the thermoelectric properties of InAs nanowires

Jeon, Seong Gi; Park, Dong Woo; Shin, Ho Sun; et al, RSC ADVANCES, v.6, no.10, pp.7791 - 7797, 2016

5

High-Power Supercapacitive Properties of Graphene Oxide Hybrid Films with Highly Conductive Molybdenum Disulfide Nanosheets

Byun, Segi; Sim, Dong Min; Yu, Jinresearcher; et al, CHEMELECTROCHEM, v.2, no.12, pp.1938 - 1946, 2015-12

6

Selective Synthesis of Nanospheres and Nanosheets of Bismuth Subcarbonate

Jeon, Seong Gi; Park, Sun Hwa; Yu, Jinresearcher; et al, CHEMISTRY LETTERS, v.44, no.12, pp.1717 - 1719, 2015-12

7

Effects of interfacial Al oxide layers: Control of reaction behavior in micrometer-scale Al/Ni multilayers

Kuk, Seoung Woo; Yu, Jinresearcher; Ryu, Ho Jinresearcher, MATERIALS & DESIGN, v.84, pp.372 - 377, 2015-11

8

Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films

Yu, Jinresearcher; Kim, Kyoungdoc, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.46A, no.7, pp.3173 - 3181, 2015-07

9

Stationary self-propagation combustion with variations in the total layer thickness of compression-bonded Ni-sputtered Al foil multilayers

Kuk, Seoung Woo; Yu, Jinresearcher; Ryu, Ho Jinresearcher, JOURNAL OF ALLOYS AND COMPOUNDS, v.626, pp.16 - 19, 2015-03

10

Self-propagation Combustion Behavior with Varying Al/Ni Ratios in Compression-Bonded Ni-sputtered Al Foil Multilayers

Kuk, Seoung Woo; Ryu, Ho Jinresearcher; Yu, Jinresearcher, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.45A, no.12, pp.5691 - 5698, 2014-11

11

Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

Kim, J. H.; Yu, Jinresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343, 2014-11

12

Twin-driven thermoelectric figure-of-merit enhancement of Bi2Te3 nanowires

Shin, Ho Sun; Jeon, Seong Gi; Yu, Jinresearcher; et al, NANOSCALE, v.6, no.11, pp.6158 - 6165, 2014-06

13

Thermopower detection of single nanowire using a MEMS device

Shin, Ho Sun; Lee, Joon Sung; Jeon, Seong Gi; et al, MEASUREMENT, v.51, pp.470 - 475, 2014-05

14

Effects of the Al/Ni ratio on the reactions in the compression-bonded Ni-sputtered Al foil multilayer

Kuk, Seoung Woo; Ryu, Ho Jinresearcher; Yu, Jinresearcher, JOURNAL OF ALLOYS AND COMPOUNDS, v.589, pp.455 - 461, 2014-03

15

Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints

Jung, Yong; Yu, Jinresearcher, JOURNAL OF APPLIED PHYSICS, v.115, no.8, 2014-02

16

Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints

Kim, Sung-Hwan; Yu, Jinresearcher, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09

17

Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

Kim, Sung-Hwan; Yu, Jinresearcher, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08

18

Enhanced Electrocatalytic Properties of Transition-Metal Dichalcogenides Sheets by Spontaneous Gold Nanoparticle Decoration

Kim, Jaemyung; Byun, Segi; Smith, Alexander J.; et al, JOURNAL OF PHYSICAL CHEMISTRY LETTERS, v.4, no.8, pp.1227 - 1232, 2013-04

19

Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints

Lee, K. O.; Yu, Jinresearcher; Park, T. S.; et al, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03

20

Ligand Conjugation of Chemically Exfoliated MoS2

Chou, Stanley S.; De, Mrinmoy; Kim, Jaemyung; et al, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.135, no.12, pp.4584 - 4587, 2013-03

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